Hitachi High-tech Corporation

Hitachi, Ltd.

Hitachi Automotive Systems, Ltd.

Hitachi-lg Data Storage, Inc.

Hitachi Consumer Electronics Co., Ltd.

Ukyo Ikeda

Masato Nakamura

Shiro Yamashita

Masafumi Miyake

Tetsuyoshi Ono

Masahide Harada

Isamu Yoshida

Taku Hoshizawa

Satoshi Ozawa

Kouji Fujita

Hideto Yoshinari

Shosaku Ishihara

Takehide Yokozuka

Shinichi Fujiwara

Hiroki Nakatsuchi

Hirofumi Taguchi

Akihiro Sato

Ryoji Ishida

An electrode formed by molding a semiconductor device with resin. The electrode comprises: a first resin mold portion formed on a front surface of the semiconductor device and having a first thickness (t); a second resin mold portion formed on a back surface of the semiconductor device and having a second thickness (t) greater than the first thickness; and an exposed portion formed in a part of the first resin mold portion corresponding to an end of the semiconductor device.

Electrode structure

The invention aims to suppress an effect of noise and heat generated from a memory on a measurement result in an ion concentration measuring device that uses an ion detection element for outputting a potential corresponding to the concentration of ions. The ion concentration measuring device according to the invention includes a cartridge having an ion detection element and a memory and supplies power to the memory in a time period excluding a time period for which the potential generated by the ion detection element is acquired.

Ion concentration measurement device

An optical information recording/reproducing apparatus for recording information on a recording medium and/or reproducing information from the recording medium, includes: a laser light source for performing recording and/or reproducing information; a shielding part, using a liquid crystal, that can switch between transmission and interception of laser light emitted from the laser light source; a driving circuit for driving the switching between transmission and interception of the shielding part; a moving part for relatively moving the shielding part and the laser light; and a controlling circuit for controlling the moving part. The moving part relatively moves the shielding part and the laser light so as to switch a region to which the laser light is applied from a first region of the shielding part to a second region thereof different from the first region, in order to prevent the liquid crystal from deteriorating.

Optical information recording/reproducing apparatus

In ultrasonic bonding of a metal terminal to a substrate pad, a thin buffer metal layer which is formed of a soft metal or a highly slidable metal is interposed between a terminal edge and a pad so as to prevent direct contact between an end of the terminal and the pad upon bonding. This makes it possible to prevent abrasion and a crack in the pad at the end of the terminal caused by pressure and an ultrasonic wave upon the ultrasonic bonding. This makes it possible to realize a compact bonded structure with high reliability.

Connection structure, power module and method of manufacturing the same

A semiconductor module of the present invention comprises a first conductive layer (film) and a second conductive layer (film) which are separately formed on the main surface of a packed substrate, a thermal diffusion plate connected by solder to the upper surface of the first conductive layer, a semiconductor element connected by solder to the upper surface of the thermal diffusion plate, and a lead having one end connected by solder to the second conductive layer and the other end connected by solder to the semiconductor element, wherein the outer periphery of the connected region where the semiconductor element is connected by solder to the upper surface of the thermal diffusion plate is formed with protrusion parts protruding up from the connecting region and a turning of the semiconductor element in the upper surface of the thermal diffusion plate in the solder connecting process is suppressed by the protrusion parts.

Power semiconductor module

Growing community of inventors

Tokyo, Japan

Ukyo Ikeda