Qualcomm Incorporated

Ukjin Roh

Shashank Sureshchandra Ekbote

Youn Sung Choi

Kwanyong Lim

Certain aspects of the present disclosure provide a structure for source or drain in a fin field-effect transistors (finFET) to increase a breakdown voltage between adjacent finFETs in a semiconductor device. One example semiconductor device generally includes a plurality of finFETs, each of the finFETs comprising a source and a drain, wherein at least the source or the drain in at least one finFET of the plurality of finFETs has a profile with at least one rounded tip to increase a breakdown voltage between the at least one finFET and an adjacent finFET in the plurality of finFETs.

SRAM source-drain structure

Selective epitaxial growth is used to form a hetero-structured source/drain region to fill an etched recess in a silicon fin for an n-type FinFET device.

FinFET with reduced series total resistance

Field-Effect Transistor (FET) devices employing an adjacent asymmetric active gate/dummy gate width layout are disclosed. In an exemplary aspect, a FET cell is provided that includes a FET device having an active gate, a source region, and a drain region. The FET cell also includes an isolation structure comprising a dummy gate over a diffusion break located adjacent to one of the source region and the drain region. The FET cell has an asymmetric active gate/dummy gate width layout in that a width of the active gate is larger than a width of the adjacent dummy gate. The increased width of the active gate provides increased gate control and the decreased width of the dummy gate increases isolation from the dummy gate, thus reducing sub-threshold leakage through the dummy gate.

Field-effect transistor (FET) devices employing adjacent asymmetric active gate / dummy gate width layout

Fin Field Effect transistors (FETs) (FinFETs) employing dielectric material layers to apply stress to channel regions are disclosed. In one aspect, a FinFET is provided that includes a substrate and a Fin disposed over the substrate. The Fin includes a source, a drain, and a channel region between the source and drain. A gate is disposed around the channel region. To apply stress to the channel region, a first dielectric material layer is disposed over the substrate and adjacent to one side of the Fin. A second dielectric material layer is disposed over the substrate and adjacent to another side of the Fin. The dielectric material layers apply stress along the Fin, including the channel region. The level of stress applied by the dielectric material layers is not dependent on the volume of each layer.

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Ukjin Roh