Hitachi, Ltd.

Toyota Jidosha Kabushiki Kaisha

Kabushiki Kaisha Toyota Chuo Kenkyusho

Tohoku University

Renesas Technology Corp.

Nippon Tokushu Kent Co., Ltd.

Ui Yamaguchi

Souichi Katagiri

Kan Yasui

Yutaka Nonomura

Masayoshi Esashi

Shuji Tanaka

Takahiro Nakayama

Hitoshi Yamada

Masanori Muroyama

Mitsutoshi Makihata

Yoshio Kawamura

Motohiro Fujiyoshi

Masayuki Nagasawa

Sakae Matsuzaki

Seiichi Kondo

Hirofumi Funabashi

Yoshiyuki Hata

Nobuhiro Sekimoto

Kazuya Yamamoto

Masahiko Sato

Kunio Harada

Minoru Honda

Teruhisa Akashi

Yoshiteru Omura

Akira Date

Soichi Katagiri

Hiroki Miyamoto

Yoshihiro Okumatsu

Masayuki Oyamatsu

Masatomo Tanaka

Satoshi Osabe

Masahiro Kaise

An electronic unit includes a USB host and a USB device. After the USB host and the USB device are connected to each other by a USB cable, a signal requesting for a connection permission is transmitted from the USB device to the USB host, and the USB host determines whether to permit a connection based on the signal. The electronic unit further includes a power supply configured to supply power to the USB device, and an additional GND pattern different from a GND pattern of the USB cable is electrically connected to a GND of the USB port of at least one of the USB host and the USB device. An area of the additional GND pattern is 2000 mmor more.

Electronic unit having a USB host connected to a USB device

An autonomous mobile object includes: a moving mechanism; a power-receiving terminal that is supplied with power from a power-supply terminal; an imaging unit configured to image the power-supply terminal at a position separated from the power-supply terminal by more than a distance at which the power-receiving terminal is capable of being supplied with power from the power-supply terminal; a determination unit configured to determine whether to remove contamination of the power-supply terminal based on an analysis result obtained by analyzing the image captured by the imaging unit and information on misalignment between the power-supply terminal and the power-receiving terminal, the misalignment being predicted when the autonomous mobile object moves to a position at which the power-receiving terminal is capable of being supplied with power from the power-supply terminal; and a removal unit configured to remove the contamination when the determination unit determines to remove the contamination.

Autonomous mobile object and storage medium for autonomous mobile object

An integrated device with high insulation tolerance is provided. A groove having an inclined side surface is provided between adjacent devices. When a side where an electronic circuit or MEMS device is mounted is a front surface, the groove becomes narrower from the front surface to a back surface because of the inclined surface. A mold material (insulating material) is disposed inside the groove, so that the plurality of devices are mechanically joined together, being electrically insulated from one another. A line member that establishes an electrical conduction between the adjacent devices is formed to lie along the side surface and the bottom surface of the groove. To lead the line out to the backside, the bottom surface of the groove has a hole, so that the line member is exposed to the backside from the hole.

Integrated device

A touch sensor system includes buses, a plurality of touch sensor devices disposed on the buses, and an information integrating device that is connected to all the buses and integrates information from the touch sensor device. The touch sensor device includes a sensor unit and a signal processing unit that transmits a sensor data signal generated by processing an analog sensor signal to the information integrating device through the bus. The signal processing unit includes a digital converting unit, a threshold evaluating unit that gives a start permission of the signal process when a sensor value exceeds a preset threshold, an ID adding unit that adds a transmitter identification number to the sensor signal, and a data transmitting unit that outputs the sensor data signal to a signal line of the bus. Fast responses are made possible without increasing the amount of data and host processing load while including many touch sensor elements.

Touch sensor system

A dynamic quantity sensor includes a force receiving portion, a first movable portion that rotates in a first rotational direction around a first rotational axis according to dynamic quantity in a first direction that the force receiving portion receives, and rotates in the first rotational direction around the first rotational axis according to dynamic quantity in a second direction different from the first direction that the force receiving portion receives; and a second movable portion that rotates in a second rotational direction around a second rotational axis according to the dynamic quantity in the first direction that the force receiving portion receives, and rotates in an opposite direction to the second rotational direction around the second rotational axis according to the dynamic quantity in the second direction that the force receiving portion receives.

Dynamic quantity sensor and dynamic quantity sensor system

Provided is a technique for packaging a sensor structure having a contact sensing surface and a signal processing LSI that processes a sensor signal. The sensor structure has the contact sensing surface and sensor electrodes. The signal processing integrated circuit is embedded in a semiconductor substrate. The sensor structure and the semiconductor substrate are bonded by a bonding layer, forming a sensor device as a single chip. The sensor electrodes and the integrated circuit are sealed inside the sensor device, and the sensor electrodes and external terminals of the integrated circuit are led out to the back surface of the semiconductor substrate through a side surface of the semiconductor substrate.

Sensor device having electrode draw-out portions through side of substrate

Provided are multiple normal stress detection sensor units capable of detecting a normal stress, and a sheet layer portion. The sheet layer portion includes an exterior sheet layer portion, a force detection sheet layer portion incorporating normal stress detection units, and an intermediary layer sandwiched between the exterior sheet layer portion and the force detection sheet layer portion. The exterior sheet layer portion and the force detection sheet layer portion include multiple protrusions protruding in directions opposed to each other, and are disposed such that the protrusions engage each other with the intermediary layer interposed therebetween. Each normal stress detection sensor unit includes a central portion detection sensor device disposed immediately below a central portion of the protrusion provided on the force detection sheet portion, and at least two edge detection sensor devices disposed immediately below edge portions of the protrusion provided on the force detection sheet portion.

Sheet-like tactile sensor system

A sensor system includes a first sensing device that includes a sensor, and first and second surrounding portions that surround the sensor at least partially, a second sensing device that comprises a sensor, and first and second surrounding portions that surround the sensor at least partially, wherein at least one of a combination of shapes of the first and second surrounding portions of the respective first and second sensing devices and a combination of physical properties of the first and second surrounding portions of the respective first and second sensing devices is configured such that a detection characteristic of the first sensing device is different from a detection characteristic of the second sensing device.

Sensor system

A picture recorder that records TV broadcast programs and skips commercial sections included in broadcasts for reproduction, includes: an audio input unit that separates an audio signal from the broadcast program; and an audio processing unit that detects a commercial section from an audio signal separated in the audio input unit, and generates the reproduction position information indicating the position of the commercial section. The audio processing unit includes: a silent section determining unit that compares the level of an audio signal included in the broadcast program with a threshold V, and determines a section less than Vas a silent section; and a commercial section determining unit that, when the interval T between adjacent silent sections matches a predetermined time length Tc, determines a section sandwiched by the silent sections as a commercial section.

Picture recorder and commercial message detection method

In hybrid peer-to-peer type content delivery, a server confirms user's intension as to content disclosure, guarantees content delivery by mutual authentication between a client to which content has been delivered and a client to which content has not been delivered, and guarantees the integrity of content having been delivered. Further, the server configures delivery connection based on the network relationship between the clients and priority factors taking account of a reservation status.

Content delivery method, server, and terminal

The object of the invention is to provide a method of manufacturing a semiconductor device and a processing apparatus for planarization wherein to form copper wiring in multiple layers. The removal of a residue of polishing by local electro polishing, the enhancement of the performance of planarization by using a grindstone and the reduction by small frictional force in electro polishing of damage, are enabled. To achieve the object, the following measures are taken. A residue of polishing of copper is removed by combining the detection of a local area including the residue of polishing of copper and local processing for electro polishing. As small-load processing for planarization is enabled by using electro polishing, multilayer interconnection structure using low-k material as a dielectric interlayer is also enabled. Plural pairs of small unit electrodes in a pair of which minus electrodes surround a plus electrode are provided to a tool for electro polishing, each electrode is connected to a power supply, pulse voltage is applied to each electrode and copper is electrolytically polished.

Method for manufacturing semiconductor device and apparatus for manufacturing thereof

The invention provides a method for manufacturing a semiconductor device with reduced dishing and erosion. In this method for manufacturing a semiconductor device, the convex/concave pattern is planarized by relatively moving a substrate having the convex/concave pattern on the surface and a polishing tool with pressing the convex/concave surface of the substrate on the polishing tool. The polishing tool is provided with a grindstonehaving a plurality of polygonal segments, which comprises abrasivethat is bonded together with resinand contains pores. The polygonal segments are arranged so that corners of three or more polygonal segments are not located near each other.

Method for manufacturing a semiconductor device that includes planarizing with a grindstone that contains fixed abrasives

In a production process of a semiconductor device, planarizing of a wafer surface pattern can be performed to attain high planarity, good uniformity in the removal amount and improved controllability. This process include a step of planarizing a semiconductor wafer, from which at least two different films have been exposed, by polishing with a grindstone and a dispersant-containing processing liquid.

Planarizing method of semiconductor wafer and apparatus thereof

A method of manufacturing is described wherein a semiconductor device has a substrate as workpiece with an insulation film formed on the substrate, openings formed inside the insulation film, a first conductive film is formed inside the openings and on a surface of the insulation film, a second conductive film is formed on the first conductive film, and the first and the second conductive films are formed inside openings by planarizing a surface of second conductive film and a surface part of the first conductive film with a fixed abrasive tool. The method includes supplying a first processing liquid, planarizing the surface of the second conductive film with the first processing liquid and the fixed abrasive tool, switching the supply of liquid from a first processing liquid to a second processing liquid, and planarizing the surface of second conductive film and the surface of part of the first conductive film with the second processing liquid and the fixed abrasive tool.

Growing community of inventors

Toyota, Japan

Ui Yamaguchi