Robert Boschgmbh

Udo Hennel

Udo Schulz

Thomas Wiesa

Roland Schmid

Manfred Kirschner

Michael Werner

Stefan Doehren

Ralf Schinzel

Thomas Proepper

Andre Lischeck

Heinrich Barth

Alexander Geissler

Hans-Uwe Rempler

Armin Lachenmaier

Thomas Uhland

Kai Beckbissinger

Georg Meincke

Dietrich Koehn

Mathias Buettner

Gurusamy Vijay Amalraj

Ivan Adamis

Stephan Dieke

The invention relates to an electronic unit (') comprising at least one printed circuit board () which is populated with a plurality of electric and/or electronic components () on one side or on both sides and which is incorporated into at least one protective housing () made of a solidified potting compound (&#x2032;). In the process, the electronic unit overall forms a volume body () in which the solidified potting compound takes up a filling volume (). In order to minimize the filling volume, the electronic unit additionally comprises a separate insert molding part () which is arranged at least adjacently to a populated side of the at least one printed circuit board and which takes up a spatially closed displacement volume in the volume body with respect to a flowable potting compound for forming the protective housing in a solidified state (&#x2032;).

Electronic unit and method for forming an electronic unit

In a method for fixing an electrical or an electronic component, particularly a printed-circuit board, in a housing used to accommodate the component, and a fixing element for fixing the component by clamping it in place, the component is fitted with at least one fixing element, which includes an elastically yielding press-on part which, during the clamping in place of the component in the housing, is brought to lie against a part of the housing and is pressed against it while being deformed.

Method for fixing an electrical or an electronic component, particularly a printed-circuit board, in a housing and fixing element therefor

In a module frame for electronic components, having a conductor structure having a metallic conductor, at least one contact segment of a metallic conductor, the at least one contact segment of the metallic conductor uncovered by the insulation sheathing and conductively connected to a segment of the metallic conductor, the thermal conduction cross section of the at least one connecting web being designed to be so small that when the contact segment is intensely heated, the connecting web has a throttling effect on the heat flow to the segment of the conductor.

Module support for electrical/electronic components

Growing community of inventors

Sachsenheim, Germany

Udo Hennel