Atotech Deutschland Gmbh

Udo Grieser

Heinrich Meyer

Wolfgang Dahms

Christopher Grieser, Legal Representative

Olanda Grieser, Legal Representative

Heiko Brunner

Uwe Hauf

Philip Hartmann

Akif Özkök

Thomas Moritz

Birgit Sonntag

Harry Fuerhaupter

Alexey Stiop

Barrie Sydney James

The invention relates to a polyvinylammonium compound, to a method of manufacturing said compound, to an aqueous acidic solution containing at least said Polyvinylammonium compound for electrolytically depositing a copper deposit as well as to a method of electrolytically depositing a copper deposit using said aqueous acidic solution, said polyinylammonium compound corresponding to the general chemical formula (1): as well as to polyvinylammonium compounds of the general chemical formula (1), wherein one of the monomer units or both having indices I and m are present in the neutral form.

Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit

For the reproducible manufacturing of particularly uniform and brilliant i.e., highly bright copper coatings that are leveled and ductile as well, a copper plating bath is utilized that contains as an additive a mixture of oligomeric phenazinium compounds. The mixture contains at least one phenazinium compound selected from the group comprising compounds containing two monomeric units and compounds containing three monomeric units having the general chemical formulae &#x3c;I&#x3e; and &#x3c;II&#x3e; set forth in the patent claims and in the specification as well as further oligomeric phenazinium compounds. 

Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit

For manufacturing particularly uniform and mirror bright copper coatings that are leveled and ductile as well using a relatively high current density, halogenated or pseudohalogenated monomeric pheanzinium compounds or a purity at least 85 mole-% and having the general chemical formula (I) are utilized in which R, R, R, R, R, R, R, R, X and A have the significations denoted in the claims. The compounds are prepared by diazotizing a suited starting compound prior to halogenating or pseudohalogenating it in the presence of mineral acid, diazotization means and halide or pseudohalide, with the reaction steps being run in one single vessel.

Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds

The present invention relates to a solution and to a method of treating copper surfaces, the copper surfaces being brought into contact with an acidic treatment liquid which contains hydrogen peroxide and at least one five-membered heterocyclic compound as well as additionally at least one microstructure modifying agent selected from the group comprising thioles A, disulfides B, sulfides C and thioamides D having the following respective general formulae: wherein Rand R=alkyl, alkenyl, aryl, aralkyl, especially benzyl, cycloalkyl and the derivatives thereof and R=R, R&#x2014;O, R&#x2014;S, amino or substituted amino, wherein Rand Rmay especially be phenyl or substituted phenyl.

Acidic treatment liquid and method of treating copper surfaces

A process to pretreat copper surfaces for tight bonding to organic substrates as those found in multilayer printed circuit boards includes first treating the copper with a solution containing hydrogen peroxide, and at least one acid, and at least one nitrogen-containing five-member heterocyclic compound which does not contain sulfur, selenium or tellurium atoms in the heterocycle. Thereafter the copper surfaces are brought into contact with a second solution containing at least one adhesion-promoting compound from the group consisting of sufinic acid, selinic acid, telluric acid, and heterocyclic compounds that contain at least one sulfur, and/or selenium and/or tellurium atom in the heterocycie and also sulfonium, selenonium and telluronium salts.

Process for the preliminary treatment of copper surfaces

Cyanide-free aqueous alkaline bath used for the galvanic application of zinc or zinc-alloy coatings

A method of reproducibly manufacturing circuit carriers with very fine circuit structures, more specifically with structure widths of 50 &mgr;m and less, is described in which a substrate provided with a base metal surface is provided, a layer of varnish is applied onto the substrate by an electrophoretic method, the layer of varnish is ablated in at least parts of the regions that do not correspond to the metal pattern to be formed, the base metal surface being laid bare, the bare base metal surface is etched, the layer of varnish being ablated by means of ultraviolet irradiation, more specifically with an ultraviolet laser beam.

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Berlin, Germany

Udo Grieser