Institut Fur Mikrotechnik Mainz Gmbh

Udo Berg

Wolfgang Ehrfeld

Matthias Nienhaus

Felix Schmitz

Marc Begemann

Yannick Ansel

The invention relates to an assembly device for microcomponents that are disposed in a magazine. The inventive assembly device does not require any optical systems and allows for an exact positioning of the microcomponents. The assembly will also be unaffected by any position changes of the microcomponents caused by wastage. The assembly device is provided with mechanical alignment devices that engage with or act upon adjustment structures of the magazine. The assembly device further comprises clamping devices for fixing the magazine and at least one plunger for ejecting at least one microcomponent from the magazine. An assembly platform is provided in the upper tool or in the lower tool of the assembly device and receives the microcomponents in a defined position. The invention further relates to a method for assembling microcomponents and to a corresponding magazine.

Magazine, assembly device for microcomponents

Disclosed is a method for assembling cassette-loaded microcomponents, requiring only a small number of component-specific ejector tools and capable of being implemented more quickly. According to the inventive method, at least two cassettes provided with component carriers are used, whereby each cassette has at least one type of component and the positions of the components are adapted to each other. At least one cassette acts as a base plate cassette wherein the microcomponents are arranged on a base plate acting as a component carrier. At least one joint assembly step is carried out, wherein two cassettes are respectively placed opposite each other and all microcomponents in the joined cassettes are simultaneously assembled to form sub-assemblies or component units. The component carriers of the cassettes are subsequently withdrawn. During assembly, the microcomponents can also be held in a rotationally secure position. The invention also relates to an assembly device for assembling cassette-loaded microcomponents.

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Bad Homburg, Germany

Udo Berg