Applied Materials, Inc.

Intel Corporation

Uday Mahajan

Chin Hock Toh

Aksel Kitowski

Todd William Martin

Tzay-Fa Su

Liming Zhang

Thean Ming Tan

David Morishige

Patterned photoresist is used to attach a carrier wafer to a silicon device wafer. In one example, a silicon wafer is patterned for contact bumps by applying a photoresist over a surface of the wafer and removing the photoresist in locations at which the contact bumps are to be formed. The contact bumps are formed in the locations at which the photoresist is removed. A temporary carrier is attached to the photoresist over the wafer. The back side of the wafer opposite the contact bumps is processed while handling the wafer using the temporary carrier. The temporary carrier is removed. The photoresist on the front side of the wafer with the contact bumps is removed after removing the temporary carrier.

Patterned photoresist to attach a carrier wafer to a silicon device wafer

Thin substrates and mold compound handling is described using an electrostatic-chucking carrier. In one example, a first part of a plurality of silicon chip packages is formed on a front side of a silicon substrate wafer at a first processing station. An a carrier wafer of an electrostatic chuck is attached over the front side of the silicon wafer. The substrate wafer is moved to a second processing station. A second part of the plurality of silicon chip packages are formed on a back side of the silicon wafer at a second processing station. The electrostatic chuck is then released.

Thin substrate and mold compound handling using an electrostatic-chucking carrier

The present invention provides a method and apparatus for edge film stack removal process for fabricating photovoltaic devices. In one embodiment, a method for manufacturing solar cell devices on a substrate includes providing a substrate into a chemical vapor deposition chamber, contacting a shadow frame disposed in the deposition chamber to a periphery region of the substrate, depositing a silicon-containing layer on the substrate through an aperture defined by the shadow frame, transferring the substrate to a physical vapor deposition chamber, depositing a transparent conductive layer on the silicon-containing layer, transferring the substrate to a laser edge removal tool, and laser scribing the layers formed on the periphery region of the substrate.

Edge film removal process for thin film solar cell applications

A selective polish for fabricating electronic devices is disclosed. The selective polish may include the use of a slurry that facilitates the selective polish of a first component but does not substantially polish a second component.

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Singapore, Singapore

Uday Mahajan