Google Inc.

Uday Kumar Dasari

Ravi Narayanaswami

Olivier Temam

Andreas Georg Nowatzyk

Dong Hyuk Woo

Suyog Gupta

Ali Iranli

Pavan Thirunagari

Vinu Vijay Kumar

Sunitha R Kosireddy

Apparatus and methods for processing neural network models are provided. The apparatus can comprise a plurality of identical artificial intelligence processing dies. Each artificial intelligence processing die among the plurality of identical artificial intelligence processing dies can include at least one inter-die input block and at least one inter-die output block. Each artificial intelligence processing die among the plurality of identical artificial intelligence processing dies is communicatively coupled to another artificial intelligence processing die among the plurality of identical artificial intelligence processing dies by way of one or more communication paths from the at least one inter-die output block of the artificial intelligence processing die to the at least one inter-die input block of the artificial intelligence processing die. Each artificial intelligence processing die among the plurality of identical artificial intelligence processing dies corresponds to at least one layer of a neural network.

Apparatus and mechanism for processing neural network tasks using a single chip package with multiple identical dies

Components on an IC chip may operate faster or provide higher performance relative to power consumption if allowed access to sufficient memory resources. If every component is provided its own memory, however, the chip becomes expensive. In described implementations, memory is shared between two or more components. For example, a processing component can include computational circuitry and a memory coupled thereto. A multi-component cache controller is coupled to the memory. Logic circuitry is coupled to the cache controller and the memory. The logic circuitry selectively separates the memory into multiple memory partitions. A first memory partition can be allocated to the computational circuitry and provide storage to the computational circuitry. A second memory partition can be allocated to the cache controller and provide storage to multiple components. The relative capacities of the memory partitions are adjustable to accommodate fluctuating demands without dedicating individual memories to the components.

Multi-partition memory sharing with multiple components

A three dimensional neural network accelerator that includes a first neural network accelerator tile that includes a first transmission coil, and a second neural network accelerator tile that includes a second transmission coil, wherein the first neural network accelerator tile is adjacent to and aligned vertically with the second neural network accelerator tile, and wherein the first transmission coil is configured to wirelessly communicate with the second transmission coil via inductive coupling.

Neural network accelerator tile architecture with three-dimensional stacking

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Union City, CA, United States of America

Uday Kumar Dasari