Taiwan Semiconductor Manufacturing Comp. Ltd.

Tzung-Luen Li

Yen-Ming Chen

Dian-Hau Chen

Chih-Fan Huang

Tzu-Li Lee

Mao-Nan Wang

In some embodiments, the present disclosure relates to a method including forming an interconnect structure over a substrate. A bond pad may be coupled to the interconnect structure, and a polymeric material may be deposited over the bond pad. In some embodiments, the method further includes performing a patterning process to remove a portion of the polymeric material to form an opening in the polymeric material. The opening directly overlies and exposes the bond pad. Further, the method includes a first cleaning process. The polymeric material is cured to form a polymeric protection layer, and a second cleaning process is performed.

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Hsin-Chu, Taiwan

Tzung-Luen Li