Playnitride Inc.

Chunghwa Picture Tubes, Ltd.

Tzu-Yu Ting

Yu-Hung Lai

Yi-Chun Shih

Jan-Tian Lian

Sheng-Chieh Liang

Hsiang-Wen Tang

Hung-Yu Wu

Hsin-Min Fu

Chia-Sheng Hsieh

Chuan-Tsung Su

A method of manufacturing display device is disclosed. A substrate includes a basal layer and metal contacts on the top surface. An insulation layer is disposed on the top surface and includes a first mounting surface and a bottom surface. Multiple grooves are formed on the insulation layer and each extends from the first mounting surface to the bottom surface. The grooves respectively correspond to the metal contacts and expose respective metal contacts. An electromagnetic force is provided with a direction from the basal layer toward the insulation layer. A droplet containing multiple micro components is provided on the first mounting surface. A configuration of an electrode of the micro component corresponds to a configuration of one of the grooves. The electrode is attracted to the corresponding groove by the electromagnetic force so as to electrically contact the metal contact.

Display device, method of manufacturing the same and substrate of the same

A transfer carrier is adapted to be connected to an electrode of a micro light-emitting element and transfer the micro light-emitting element. A transfer carrier includes a transfer substrate and a plurality of metal bonding pads. The metal bonding pads are disposed on the transfer substrate, and every two metal bonding pads that are adjacent to each other are spaced apart from each other through a gap.

Transfer carrier for micro light-emitting element

A method of manufacturing micro light-emitting element array is disclosed. A transfer substrate and at least one metal bonding pad are provided, and the metal bonding pad is disposed on the transfer substrate. A growth substrate and a plurality of micro light-emitting elements are provided. The micro light-emitting elements are disposed on the growth substrate, and a surface of each of the micro light-emitting elements away from the growth substrate having at least one electrode. The metal bonding pad is molten at a heating temperature, and the electrode is connected to the metal bonding pad. Then, the growth substrate is removed.

Method of manufacturing micro light-emitting element array, transfer carrier, and micro light-emitting element array

A method of manufacturing display device is disclosed. a substrate includes a basal layer and metal contacts on the top surface. An insulation layer is disposed on the top surface and includes a first mounting surface and a bottom surface. Multiple grooves are formed on the insulation layer and each extends from the first mounting surface to the bottom surface. The grooves respectively correspond to the metal contacts and expose respective metal contacts. An electromagnetic force is provided with a direction from the basal layer toward the insulation layer. A droplet containing multiple micro components is provided on the first mounting surface. A configuration of an electrode of the micro component corresponds to a configuration of one of the grooves. The electrode is attracted to the corresponding groove by the electromagnetic force so as to electrically contact the metal contact.

A head-up display module is provided. The head-up display module includes a polarized light source, an optical sheet, and a display panel. The polarized light source is capable of emitting a polarized light beam. The optical sheet is disposed on a transmission path of the polarized light beam, and the polarized light beam is reflected by the optical sheet. The display panel is disposed on the transmission path of the polarized light beam between the polarized light source and the optical sheet, and a polarization of the polarized light beam is modulated by the display panel.

Head-up display module

A flexible device substrate includes a flexible substrate, a device layer, and a waterproof layer. The flexible substrate has a top surface and a bottom surface disposed opposite to each other. The device layer is disposed on the top surface of the flexible substrate. The waterproof layer is disposed on the bottom surface of the flexible substrate.

Growing community of inventors

Tainan, Taiwan

Tzu-Yu Ting