Chroma Ate Inc.

Tzu-Tu Chao

Min-Hung Chang

Tsun-I Wang

I-Shih Tseng

Mao-Sheng Liu

Chin-Yuan Chang

Ching-Lin Lee

Cheng-Hung Pan

A wafer inspection method and inspection apparatus that perform a voltage inspection of a die on a wafer by a probe module. The probe module includes a processing module, a first probe coupled to a first electrode point of the die, and a second probe coupled to a second electrode point of the die. The first probe is coupled to the processing module, and the second probe is grounded. The processing module provides the die with a driving current through the first probe, and obtains an inspection voltage corresponding to the die. The processing module generates an inspection result of the inspection voltage based on two reference voltages respectively representing a high critical threshold value and a low critical threshold value of the die under a normal operation. The inspection result indicates an operating status of the die. Thus, inspection costs are reduced and inspection efficiency is enhanced.

Wafer inspection method and inspection apparatus

A wafer inspection method and inspection apparatus are provided. On a wafer having layout lines connecting electrode points of individual dies in series, the dies within a matrix range are inspected one after another in turn in a column/row control means by a first switch group and a second switch group of a probe card, so that each die is selectively configured in a test loop of a test process by turning on/off of a corresponding switch. Thus, after inspection of a die under inspection (a selected die) within the matrix range is complete, the column/row control means is used to switch to a next die to achieve fast switching. Accordingly, for the inspection procedure of each die within the matrix region, a conventional procedure of moving one after another in turn can be eliminated, significantly reducing the total test time needed and enhancing inspection efficiency.

Herein disclosed are a method and a test probe for testing an electrical component. The electrical component comprises at least a first electrode and a second electrode. The method comprises the following steps: covering the first electrode with a first conducting flexible layer; driving a first electrode contact to electrically connect a first end of the first electrode contact with the first electrode via the first conducting flexible layer; covering the second electrode with a second conducting flexible layer; and driving a second electrode contact to electrically connect a second end of the second electrode contact with the second electrode via the second conducting flexible layer. The first conducting flexible layer is an anisotropic conductive film.

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Taoyuan, Taiwan

Tzu-Tu Chao