Taiwan Semiconductor Manufacturing Comp. Ltd.

Tzu-Ting Chou

Chih-Wei Lin

Ching-Hua Hsieh

Sheng-Chi Chin

Ting-Hao Hsu

Kuan-Wen Lin

Wei-Cheng Wu

Chi-Lun Lu

Yu-Wei Lin

Shih-Peng Tai

Tzu-Shiun Sheu

Chung-Hsuan Liu

Chun-Yen Lan

Sheng-Hsiang Chiu

Sheng-Feng Weng

Chao-Wei Li

Chia-Min Lin

Shu-Hsien Wu

A package structure including a substrate, a first semiconductor element disposed on and electrically connected with the substrate, a second semiconductor element disposed on and electrically connected with the substrate and a molding layer disposed over the substrate and covering at least a top surface of the substrate. The second semiconductor element and the first semiconductor element perform different functions. The molding layer encapsulates the second semiconductor element and wraps around sidewalls of the first semiconductor element. A top surface of the molding layer is higher than a top surface of the first semiconductor element. The molding layer has an opening extending from the top surface of the molding layer to the top surface of the first semiconductor element, so that the top surface of the first semiconductor element is exposed.

Package structure and manufacturing method thereof

A semiconductor device includes a circuit substrate, a semiconductor package, and a package frame. The semiconductor package is disposed on the circuit substrate. The package frame is disposed over the circuit substrate. The package frame encircles the semiconductor package. The semiconductor package has a first surface facing the circuit substrate and a second surface opposite to the first surface. The package frame leaves exposed at least a portion of the second surface of the semiconductor package. The package frame forms a cavity, which cavity encircles the semiconductor package.

Semiconductor device and manufacturing method thereof

An extreme ultraviolet (EUV) mask is received. The EUV mask has an EUV pellicle disposed thereover. The EUV pellicle is coupled to the EUV mask at least in part via glue that is disposed on the EUV mask. The EUV pellicle is removed, thereby exposing the glue. A localized glue-removal process is performed by targeting a region of the EUV mask on which the glue is disposed. The localized glue-removal process is performed without affecting other regions of the EUV mask that do not have the glue disposed thereon. The localized glue-removal process may include injecting a cleaning chemical onto the glue and removing a waste chemical produced by the cleaning chemical and the glue. The localized glue-removal process may also include a plasma process that applies plasma to the glue. The localized glue-removal process may further include a laser process that shoots a focused laser beam at the glue.

System and method for localized EUV pellicle glue removal

An extreme ultraviolet (EUV) mask having a pellicle disposed thereover is received. The EUV pellicle is coupled to the EUV mask at least in part via glue that is disposed on the EUV mask. The EUV pellicle is removed, thereby exposing the glue. A localized glue-removal process is performed by targeting a region of the EUV mask on which the glue is disposed. The localized glue-removal process is performed without affecting other regions of the EUV mask that do not have the glue disposed thereon. The localized glue-removal process may include injecting a cleaning chemical onto the glue and removing a waste chemical produced by the cleaning chemical and the glue. The localized glue-removal process may also include a plasma process that applies plasma to the glue. The localized glue-removal process may further include a laser process that shoots a focused laser beam at the glue.

A pellicle mask assembly includes a mask, a pellicle frame, and a pellicle membrane. The pellicle frame has a bottom side attached to the mask, and a top side covered by the pellicle membrane. The pellicle frame includes a coating on its inner surface and the coating is configured to monitor a change of environment inside the pellicle mask assembly. In embodiments, the change of environment includes increased humidity and/or increased chemical ion density inside the pellicle mask assembly. Methods of making and using the pellicle mask assembly are also disclosed.

Mask pellicle indicator for haze prevention

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Hsin-Chu, Taiwan

Tzu-Ting Chou