Taiwan Semiconductor Manufacturing Comp. Ltd.

Tzu-Shiun Sheu

Shih-Peng Tai

Chen-Hua Douglas Yu

Shin-Puu Jeng

An-Jhih Su

Chi-Hsi Wu

Wei-Cheng Wu

Chih-Wei Lin

Ching-Hua Hsieh

Yu-Wei Lin

Tzu-Ting Chou

Chun-Yen Lan

Hsien-Wei Chen

Cheng-Hsien Hsieh

Li-Han Hsu

Yan-Fu Lin

Chin-Te Wang

A semiconductor device includes a circuit substrate, a semiconductor package, and a package frame. The semiconductor package is disposed on the circuit substrate. The package frame is disposed over the circuit substrate. The package frame encircles the semiconductor package. The semiconductor package has a first surface facing the circuit substrate and a second surface opposite to the first surface. The package frame leaves exposed at least a portion of the second surface of the semiconductor package. The package frame forms a cavity, which cavity encircles the semiconductor package.

Semiconductor device and manufacturing method thereof

A method includes mounting a wafer-level package substrate over a carrier, and pre-cutting the wafer-level package substrate to form trenches extending from a top surface of the wafer-level package substrate into the wafer-level package substrate. A plurality of dies is bonded over the wafer-level package substrate. The plurality of dies is molded in a molding material to form a wafer-level package, with the wafer-level package including the wafer-level package substrate, the plurality of dies, and the molding material. The carrier is detached from the wafer-level package. The wafer-level package is sawed into a plurality of packages, with each of the plurality of packages including a portion of the wafer-level package substrate and one of the plurality of dies.

Chip-on-substrate packaging on carrier

A semiconductor device including an integrated circuit, a protection layer, and a conductive via is provided. The integrated circuit includes at least one conductive pad. The protection layer covers the integrated circuit. The protection layer includes a contact opening, and the conductive pad is exposed by the contact opening of the protection layer. The conductive via is embedded in the contact opening of the protection layer, and the conductive via is electrically connected to the conductive pad through the contact opening. A method of fabricating the above-mentioned semiconductor device and an integrated fan-out package including the above-mentioned semiconductor device are also provided.

Integrated fan-out package, semiconductor device, and method of fabricating the same

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Hsinchu, Taiwan

Tzu-Shiun Sheu