United Microelectronics Corp.

Tzu-Ping Kao

Chen-Hui Huang

Ching-Hsing Hsieh

Chung-Hsuan Wu

Chia-Chi Chang

Nai-Ying Lo

Ju-Te Chen

Yung-Yu Yang

Cheng-Hsien Chen

Chia-Feng Hsiao

Yi-Hui Tseng

Shuo-Yu Chen

An automatic detection method and an automatic detection system for detecting any crack on wafer edges are provided. The automatic detection method includes the following steps. Several wafer images of several wafers are obtained. The wafer images are integrated to create a templet image. Each of the wafer images is compared with the templet image to obtain a differential image. Each of the differential images is binarized. Each of the differential images which are binarized is de-noised. Whether each of the differential images has an edge crack is detected according to pattern of each of the differential images which are de-noised.

Automatic detection method and automatic detection system for detecting crack on wafer edges

An automatic detecting method and an automatic detecting apparatus using the same are provided. The automatic detecting apparatus includes an inputting unit, a dividing unit, a contouring unit, a range analyzing unit, a boundary analyzing unit, an edge detecting unit, an expanding unit and an overlapping unit. The dividing unit is used for dividing an overlooking image into four clusters via a clustering algorithm. The contouring unit is used for obtaining a contour. The range analyzing unit is used for obtaining a detecting range. The boundary analyzing unit is used for obtaining a circular boundary in the detecting range. The edge detecting unit is used for obtaining a plurality of edges in the circular boundary. The expanding unit is used for expanding the edges to obtain a plurality of expanded edges. The overlapping unit is used for overlapping the expanded edges and the contour to obtain a defect pattern.

Automatic detecting method and automatic detecting apparatus using the same

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Kaohsiung, Taiwan

Tzu-Ping Kao