Lite-on Technology Corporation

Silitek Electronic (guangzhou) Co., Ltd.

E-pin Optical Industry Co., Ltd.

Sampo Corporation

Tzu-Kan Chen

Cheng-Te Tseng

Chia-Hsi Tsai

Meng-Hsin Kuo

Yi-Ting Lin

Jin-Chern Chiou

Yung-Jiun Lin

Jyh-Horng Chen

Chyr-Pwu Tzou

The optical image stabilizer includes a substrate, a carrier movably disposed above the substrate for carrying an image sensor, an anchor fixed above the substrate, a conducting pad fixed above the anchor for coupling an image processing circuit, a flexible suspension disposed between the conducting pad and the carrier, a conducting line disposed above the flexible suspension coupled to the conducting pad and protruding over the carrier for coupling the image sensor, and a micro-actuator disposed between the substrate and the carrier for adjusting the position of the carrier according to control signals from an actuator control circuit.

Micro-optical image stabilizer

An image capturing device includes a base formed with a first receiving space defined by a bottom wall and a first surrounding wall, and a second receiving space defined by a top side of the first surrounding wall and a second surrounding wall. A lens module is mounted on the base for generating an optical image of an object. An auto-focusing module is disposed in the second receiving space for auto-focusing the optical image based on an external voltage. A sensing module is mounted in the first receiving space and on the bottom wall of the base, is disposed under the auto-focusing module, and is spaced apart from the lens module at a predetermined distance for sensing the optical image focused by the auto-focusing module so as to generate an electrical output corresponding to the optical image.

Image capturing device

A micro-optical image stabilizer is disclosed. The optical image stabilizer includes a substrate, a carrier movably disposed on the substrate for carrying an image sensor, an anchor fixed on the substrate, a conducting pad fixed on the anchor for coupling an image processing circuit, a flexible suspension disposed between the conducting pad and the carrier, a conducting line disposed on the flexible suspension coupled to the conducting pad and protruding over the carrier for coupling the image sensor, and a micro actuator disposed between the substrate and the carrier for adjusting the position of the carrier according to control signals from an actuator control circuit.

The present invention provides a manufacturing method for a wafer lens module including the steps of providing a plastic material with high thermal resistance, wherein the high temperature plastic material can be used at a reflow temperature above 250&#x25a1;; and forming the high temperature plastic material into a wafer lens module integrally. The method can form an integrated wafer lens module and simplify the manufacturing procedures. Furthermore, a wafer lens unit formed by stacking another wafer lens module on the wafer lens module manufactured by the method can have improved optical image quality.

Manufacturing method for a wafer lens module and the structure thereof

A method for making lens modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens assemblies; c) forming substrate layer by filling in the spacing grooves with a resin material; and d) cutting the wafer and the substrate layer along intersecting cutting lines each extending along one of the spacing grooves and each intervening the lens assemblies, the substrate layer being divided into a plurality of barrels respectively surrounding the lens assemblies. A lens module made by the method is also disclosed.

Method for making camera modules and camera module made thereby

A camera module includes a lens barrel, a lens, a sensing element, and an electromagnetic shield. The lens barrel defines a receiving space. The lens is mounted in the receiving space. The sensing element is covered by the lens barrel, is disposed below the lens, and is spaced apart from the lens. The sensing element includes a top face, a bottom face, a side face extending between the top and bottom faces, a plurality of first conductors mounted on the bottom face, at least one second conductor mounted on one of the top, bottom, and side faces, and a grounding element having one end connected to one of the first conductors and the other end connected to the second conductor. The electromagnetic shield is coupled to the lens barrel and includes a grounding portion electrically connected to the second conductor.

Camera module and method for making the same

A method for making a camera module includes the steps of: (a) providing a mold with a mold cavity; (b) mounting at least a sensing element and a lens within the mold cavity in such a manner that the sensing element and the lens are spaced apart from each other; and (c) forming a camera barrel by injecting a molding material into the mold cavity and by molding the molding material over the sensing element and the lens.

Method for making a camera module and camera module made thereby

An optical image pick-up lens is formed from crescent-shaped first and second lenses that may be aspherical molded glass lenses or aspherical plastic lenses. A convex surface at a first side of the first lens faces toward an object, and a convex surface at a second side of the second lens faces toward a formed image. The lens enables reduced lens length and high resolution by satisfying the following relational expressions: 0.4f&lE;d<0.9f; 0.5f&lE;&verbar;R3&verbar;&lE;100f; and 0.01<&verbar;f2&verbar;/&verbar;f1&verbar;<0.9; where, f is an overall focal length of the lens; d is a distance from the first side of the first lens to the second side of the second lens; R3 is a radius of curvature of an object side of the second lens; f1 is a focal length of the first lens; and f2 is a focal length of the second lens.

Optical image pick-up lens

A method of using a single pick-up head to read and store data in discs of different thickness, especially for CD (compact disc) and DVD (digital versatile disc), the method including the step of adjusting the electronic aperture ring to change the numerical aperture, and change the distance between the disc and the object lens subject to type of the disc used.

Growing community of inventors

Taipei, Taiwan

Tzu-Kan Chen