Advanced Semiconductor Engineering, Inc.

Institute for Information Industry

Tzu-Hua Lin

Kuan-Neng Chen

Chung-Ming Huang

Kuo-Hua Chen

Yuan-Tse Yu

Yan-Pin Huang

The disclosure relates to a semiconductor bonding structure and process and a semiconductor chip. The semiconductor bonding structure includes a first pillar, a first interface, an intermediate area, a second interface and a second pillar in sequence. The first pillar, the second pillar and the intermediate area include a first metal. The first interface and the second interface include the first metal and an oxide of a second metal. The content percentage of the first metal in the first interface and the second interface is less than that of the first metal in the intermediate area.

Semiconductor bonding structure

A method for transmitting data stream includes the steps of analyzing a request to generate a transmitting command, calculating a data receiving ability of a receiving end when receiving the transferring command, calculating an I frame dividing rate, a P frame dividing rate, and a B frame dividing rate based on the data receiving ability, dividing an I frame, a P frame, and a B frame based on the I frame dividing rate, the P frame dividing rate, and the B frame dividing rate to generate a plurality of I frame segments, P frame segments, and B frame segments, transmitting the I frame segments, P frame segments, and B frame segments of the data stream to the receiving end in turn base on the data receiving ability.

Method for transferring data stream

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Kaohsiung, Taiwan

Tzu-Hua Lin