Delta Electronics, Inc.

Tzu-Hsuan Cheng

Hsin-Chang Tsai

Shiau-Shi Lin

Chia-Yen Lee

Peng-Hsin Lee

A semiconductor device is provided. The semiconductor device includes a substrate; an active layer disposed on the substrate; a via through the active layer; and a plurality of electrodes disposed on the active layer and into the via. Additionally, a package structure that includes the semiconductor device is also provided. The electrode is electrically connected to the substrate through the via.

Semiconductor devices with via structure and package structures comprising the same

A packaging structure is provided, including a substrate, a first chip, a second chip, and a conductive unit. The substrate includes a metal carrier, a patterned insulation layer disposed on the metal carrier and partially covering the metal carrier, and a patterned conductive layer disposed on the patterned insulation layer. The first chip is disposed on the metal carrier not covered by the patterned insulation layer. The second chip is disposed on the patterned conductive layer and electrically connected to the first chip by the conductive unit.

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Taoyuan, Taiwan

Tzu-Hsuan Cheng