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Vanguard International Semiconductor Corporation

Tzu-Hsuan Chen

Li-Che Chen

Hsing-Chao Liu

A semiconductor device includes a through-substrate via structure, a first metal layer, an electronic component over the through-substrate via structure, a second metal layer and another electronic component below the through-substrate via structure. The through-substrate via structure includes a through hole penetrating from a first surface to an opposite second surface of a semiconductor substrate, and an acute angle is included between a sidewall of the through hole and the second surface on a side of the semiconductor substrate. The through-substrate via structure also includes a conductive layer that fills the through hole, and a semiconductor layer disposed in the through hole and interposed between the conductive layer and the semiconductor substrate.

Semiconductor devices, through-substrate via structures and methods for forming the same

A foldable baby trailer formed of a bottom frame unit, a trailer bar, a rear upright frame, a handle frame, and a folding control mechanism, two side frame bars and a stretcher frame is disclosed. The stretcher frame that supports a fabric seat panel for the sitting of a baby is held in a sloping position with the transverse front tube thereof spaced above the bottom frame unit at a distance so that when a baby is sitting on the fabric seat panel, the legs of the baby will not touch the ground, avoiding an accident and assuring high level of safety. When turning the handle frame backwardly downwards after pressed the operating button of the folding control mechanism, the foldable baby trailer is collapsed, saving storage space.

Growing community of inventors

Taipei, Taiwan

Tzu-Hsuan Chen