Tsinghua University

Tripod Technology Corporation

Tzu-Chien Wei

Jo-Lin Lan

Hai-Peng Cheng

Wen-Hsiang Chen

Shien-Ping Feng

Wen-Chi Hsu

Chao Peng

Ya-Huei Chang

Wei-Yen Wang

Chih-Ming Chen

Nai-Tien Ou

Tseng-Chieh Pan

Kuei-Chang Lai

Chung-Han Wu

Kuei-Po Chen

Yu-Hsiang Kao

Chin-Wei Hsu

Kuei-Wu Huang

Chi-Chao Wan

Duc-Anh Le

Yeng-Yun Wang

Hui-Hsiu Tang

Mikhail Pylnev

Ko-Chi Teng

Cheng-You Hong

The instant disclosure provides a method for manufacturing an electroless plating substrate and a method for forming a metal layer on a surface of a substrate. The method for preparing the electroless plating substrate includes: providing a substrate; attaching a self-adsorbed catalyst composition to a surface of the substrate; and performing an electroless metal deposition for forming an electroless metal layer on the surface of the substrate. The self-adsorbed catalyst composition includes a colloidal nanoparticle and a silane compound. The colloidal nanoparticle includes a palladium nanoparticle and a capping agent enclosing the palladium nanoparticle. The silane compound has at least one amino group to interact with the colloidal nanoparticle. A covalent bond between the silane compound and the surface of the substrate is formed through the at least one silane group of the silane compound. The colloid nanoparticle has a particle size ranging from 5 to 10 nanometers.

Method for manufacturing electroless plating substrate and method for forming metal layer on surface of substrate

A method for manufacturing a conductive laminate and a conductive laminate are provided. The method for manufacturing the conductive laminate includes steps of: providing a substrate having a surface; immersing the substrate into a modifying solution including a silane with a hydrophilic group to form a discontinuous modified layer on the surface of the substrate; forming a barrier layer on the surface of the substrate and the discontinuous modified layer, and forming a conductive layer on a surface of the barrier layer. The barrier layer includes a polymer, and the polymer is selected from the group consisting of: polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, polyethylene glycol, and any combination thereof.

Conductive laminate and method for manufacturing the same

A diffusion barrier structure, and a conductive laminate and a manufacturing method thereof are provided. The conductive laminate includes a substrate, a diffusion barrier structure, and a conductive layer. The diffusion barrier structure is formed between the substrate and the conductive layer. The diffusion barrier structure includes a discontinuous modifying layer and a barrier layer. The discontinuous modifying layer is disposed on the substrate. A material for composing the discontinuous modifying layer is a polymer with hydrophilic group. The barrier layer is disposed on the substrate and the discontinuous modifying layer. A material for composing the barrier layer includes at least one self-healing polymer.

Diffusion barrier structure, and conductive laminate and manufacturing method thereof

An inspection method for a multilayer semiconductor device is provided. The inspection method can investigate multilayered ensembles of a multilayer semiconductor device and obtain stratigraphic thickness (ST) maps of each layer in the multilayer semiconductor device by utilizing absorption edges of materials of interests and obtaining calibration quality curves.

Inspection method for multilayer semiconductor device

A method for electroless metal deposition and an electroless metal layer included substrate are provided. The method for electroless metal deposition includes steps as follows. a) cleaning a substrate, applying a hydrofluoric acid onto the substrate; and then applying a modifying agent onto the substrate to form a chemical oxide layer on the substrate; b) a catalyst layer is formed on the chemical oxide layer, wherein, the catalyst layer includes a plurality of colloidal nanoparticles, and each of the plurality of colloidal nanoparticles includes a palladium nanoparticle and a polymer which encapsulates the palladium nanoparticle, and c) depositing a metal on the catalyst layer through an electroless metal deposition to form an electroless metal layer.

Method for no-silane electroless metal deposition using high adhesive catalyst and product therefrom

The instant disclosure provides a method for preparing a perovskite crystal, including a mixing step, a crystallization step, a diluting step and a recrystallization step. The mixing step includes adding a first precursor and a second precursor into a solvent for forming a supersaturated solution. The crystallization step includes stirring the supersaturated solution for initiating a reaction between the first and second precursors in the supersaturated solution to form a perovskite powder in a solution. The diluting step includes adding the solvent to the solution and stirring the solution for dissociating the perovskite powder in the solution to form a clear solution. The recrystallization step includes adding a crystal seed into the clear solution for initiating a crystallization process on the crystal seed and forming the perovskite crystal.

Method for preparing perovskite crystal

The instant disclosure provides a self-adsorbed catalyst composition, a method for preparing the self-adsorbed catalyst composition and a method for manufacturing an electroless plating substrate. The self-adsorbed catalyst composition includes colloidal nanoparticles and a silane compound. The colloidal nanoparticles include palladium nanoparticles and capping agents enclosing the palladium nanoparticles. The silane compound has at least an amino group, and an interaction is established between the amino group of the silane compound and the colloidal nanoparticle.

Self-adsorbed catalyst composition, method for preparing the same and method for manufacturing electroless plating substrate

A substrate having a metallized surface is provided. The substrate includes a substrate having a silanated surface, an adhesive layer disposed on the silanated surface, and a first metallic layer bonded to the silanated surface through the adhesive layer. The adhesive layer is formed with a plurality of colloidal nanoparticle groups, and the colloidal nanoparticle group may include metallic nanoparticles capped with polymer. The first metallic layer and the adhesive layer have chemical bonds formed there between. The substrate may further include a second metallic layer which is electro-plated onto the first metallic layer. A method for metallizing a surface of a substrate is also provided.

Substrate surface metallization method and substrate having metallized surface manufactured by the same

A substrate having metallized surface is provided. The substrate having metallized surface includes a silicon substrate, an adhesive layer and a metallic layer. The silicon substrate has a silanated surface and the adhesive layer is disposed on the silanated surface. The metallic layer bonds to the silanated surface through the adhesive layer. The adhesive layer is formed with a plurality of colloidal nanoparticle groups, the colloidal nanoparticle groups each include at least one metallic nanoparticle capped with at least one polymer, and the metallic layer and the adhesive layer have chemical bonds formed there between.

A method of forming an electrode having an electrochemical catalyst layer is disclosed, which comprises providing a substrate with a conductive layer formed on the surface of a substrate, conditioning the surface of the substrate, immersing the substrate in a solution containing polymer-capped noble metal nanoclusters dispersed therein to form a polymer-protected electrochemical catalyst layer on the conditioned surface of the substrate, and thermally treating the polymer-protected electrochemical catalyst layer at a temperature approximately below 300&#xb0; C.

Method of forming an electrode including an electrochemical catalyst layer

A method of forming an electrode having an electrochemical catalyst layer is disclosed. The method includes etching a surface of a substrate, followed by immersing the substrate in a solution containing surfactants to form a conditioner layer on the surface of the substrate, and immersing the substrate in a solution containing polymer-capped noble metal nanoclusters dispersed therein to form a polymer-protected electrochemical catalyst layer on the conditioner layer.

A method of forming an electrode including an electrochemical catalyst layer is disclosed, which comprises forming a graphitized porous conductive fabric layer, optionally conditioning the graphitized porous conductive fabric layer, and dipping the graphitized porous conductive fabric layer into a solution containing a plurality of polymer-capped noble metal nanoclusters dispersed therein. The polymer-capped noble metal nanoclusters as an electrochemical catalyst layer are adsorbed onto the graphitized porous conductive fabric layer. An electrochemical device with the electrode made thereby is also contemplated.

Electrochemical device and method of fabricating the same

Disclosed is a method for preparing an electrode having an electrochemical catalyst layer, comprising the steps of: providing a substrate having a conductive layer thereon, immersing the substrate in a first solution having a conditioner to form a conditioner layer on the surface of the conductive layer, and immersing the substrate in a second solution having polymer-capped noble metal nanoclusters to form an electrochemical catalyst layer on the conditioner layer of the substrate. This method can reduce the amount of noble metal used in the electrochemical catalyst layer and is suitable for mass production.

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Hsinchu, Taiwan

Tzu-Chien Wei