Asml Netherlands B.v.

Tzu-Chao Chen

Alexander Ypma

Cédric Désiré Grouwstra

Sarathi Roy

Georgios Tsirogiannis

Dimitra Gkorou

Robert Jan Van Wijk

Jelle Nije

Frans Reinier Spiering

Wim Tjibbo Tel

Antoine Gaston Marie Kiers

Youping Zhang

Yi Zou

Boris Menchtchikov

Hakki Ergün Cekli

Yana Cheng

Chenxi Lin

Hermanus Adrianus Dillen

Te-Sheng Wang

Yichen Zhang

Simon Philip Spencer Hastings

Cyrus Emil Tabery

Davit Harutyunyan

Maxime Philippe Frederic Genin

Vadim Yourievich Timoshkov

A method for determining an image-metric of features on a substrate, the method including: obtaining a first image of a plurality of features on a substrate; obtaining one or more further images of a corresponding plurality of features on the substrate, wherein at least one of the one or more further images is of a different layer of the substrate than the first image; generating aligned versions of the first and one or more further images by performing an alignment process on the first and one or more further images; and calculating an image-metric in dependence on a comparison of the features in the aligned version of the first image and the corresponding features in the one or more aligned versions of the one or more further images.

Method in the manufacturing process of a device, a non-transitory computer-readable medium and a system configured to perform the method

A method for determining a root cause affecting yield in a process for manufacturing devices on a substrate, the method including: obtaining yield distribution data including a distribution of a yield parameter across the substrate or part thereof; obtaining sets of metrology data, each set including a spatial variation of a process parameter over the substrate or part thereof corresponding to a different layer of the substrate; comparing the yield distribution data and metrology data based on a similarity metric describing a spatial similarity between the yield distribution data and an individual set out of the sets of the metrology data; and determining a first similar set of metrology data out of the sets of metrology data, being the first set of metrology data in terms of processing order for the corresponding layers, which is determined to be similar to the yield distribution data.

Method for determining root cause affecting yield in a semiconductor manufacturing process

A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.

Optimizing an apparatus for multi-stage processing of product units

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San Jose, CA, United States of America

Tzu-Chao Chen