Unimems Manufacturing Co., Ltd.

Industrial Technology Research Institute

Tzong-Sheng Lee

Chien-An Chen

Ching-Yi Wu

Jeng-Long Ou

Chao-Wei Yeh

Kuo-Hua Tseng

Tsung-Ter Kuo

Long-Der Chen

Wen-Yang Chou

Shih-Chi Kuo

Shiang-Fu Chen

Jing-Hung Chiou

Chi-Fu Hung

Hsiao-Lung Ning

Jimmy Yu

Chin-Ming Yu

An infrared sensor array with interconnection type, comprises a substrate, a plurality of circuit units, and a plurality of infrared sensing modules. The substrate defines several sensing segments. Each sensing segment has a base portion, a connecting portion, and a testing portion. The connecting portion is arranged between the base portion and the testing portion. The circuit units are respectively formed on the sensing segments. Each circuit unit has a base circuit, a connecting circuit, and a testing circuit. The connecting circuit electrically connects to the base circuit and the testing circuit. Each base circuit is formed on each base portion, each connecting circuit is formed on each connecting portion, and each testing circuit is formed on each testing portion. The infrared sensing modules are respectively disposed on the base portions and electrically connected to the base circuits.

Infrared sensor array and manufacturing method of infrared sensor

A manufacturing method for an infrared sensor includes the following steps: providing a wafer having several chips and a substrate; forming four soldering portions, a thermistor, and an infrared sensing layer on the bottom surface of each chip, wherein the soldering portions are connected electrically to the thermistor and the infrared sensing layer; disposing a soldering material onto at least one bonding location for each soldering portion; backside-etching each chip of the wafer to form a sensing film and a surrounding wall around the sensing film; bonding the wafer and the substrate; heating the soldering materials to connect the substrate and each chip of the wafer; disposing an infrared filter on the surrounding wall of each chip; cutting the wafer and the substrate to form a plurality of individual infrared sensors. The instant disclosure further provides an associated infrared sensor.

Infrared sensor and manufacturing method thereof

The present invention provides a packaging structure of a gas detector and the method for making the same. The packaging structure of the gas detector includes a printed circuit board, a detection device and a ventilation cover. The detection device is attached to the printed circuit board by adhesive, and metallic wires are formed on the printed circuit board by wire-bonding process. The ventilation cover is positioned at the printed circuit board to cover the detection device. Signal terminals of the detection device are electrically connected with the contact terminals of the printed circuit board so as to test and check signals of the detection device. In this regard, the present invention is used to test and package a plurality of detection devices using one printed circuit board and without metallic terminals so that cost of the gas detector is significantly reduced.

Packaging structure of gas detector and method for making the same

A dual-band reflective infrared thermal imaging system is described. The dual-band reflective infrared thermal imaging system includes a reflective infrared thermal imager and a refractive visible light video camera. The refractive visible light video camera is configured at the central axis of the reflective infrared thermal imager so that the refractive visible light video camera and the reflective infrared thermal imager can synchronously and coaxially capture the images. The reflective infrared thermal imager further includes a reflective optical module and an infrared imaging sensor. The infrared images are focused on the infrared imaging sensor by way of the reflective optical module.

Dual-band reflective infrared thermal imaging system

A method to enhance the connection strength of suspended membrane leads and substrate contacts is described. A reading circuit chip is provided and a sacrificial layer is formed thereon. Subsequently, an electrical contact window is created in the sacrificial layer to expose a conductive layer of the reading circuit chip. A metal layer is filled into the contact window and a conductive membrane is formed thereon to couple electrically to the metal layer. Afterward, an infrared measuring membrane and an upper dielectric layer are formed thereon.

Method of enhancing connection strength for suspended membrane leads and substrate contacts

A multi-function detecting pen is described. The multi-function detecting pen includes a head module, a detecting chips module, a power module, a lighting module, and a control module. The head module is disposed at a front portion of the pen and the detecting chips module is followed. The detecting chips module may include at least one pressure detecting chip for measuring a pressure, e.g. tire pressure, and/or a gas detecting chip for measuring a gas concentration, e.g. alcohol concentration. The detecting chips module may further include a temperature detecting chip for measuring a temperature, e.g. ambient temperature or tympanum temperature. The head module may further include a switchable or a replaceable adapter for coupling to the corresponding object and keeping the head module clean.

Multi-function detecting pen

A microprocessor-based gas meter has fully electronic control, safety cutoff and data communication functions, while remains the same size of a conventional gas meter. The control circuit board in the microprocessor-based gas meter is mounted inside the main body of the gas meter through a mounting slot. The sensors, wires and battery are located in the rest space of the chamber so as to utilize the space of the chamber. When an abnormal situation is detected, the control circuit activates a cutoff valve and shuts off the gas intake. The data communication function is to transfer gas-metering data through telephone lines to the gas company so that the mistakes and cost of manual checking and recording can be eliminated.

Microprocessor-based gas meter

An intelligent air-condition system that detects the signals of the temperature distribution among the environment by using the infrared radiation, especially detects the location of the human-body temperature signals. Hence, according to the detected signals, the gas(es) for air-conditions can be firstly transmitted into the location where the human-body temperature signals exist, or be firstly transmitted into where the local temperature is urgent to be adjusted. Besides, the transitions of the gas(es) can be paused or stopped while there is no human-body temperature.

Intelligent air-condition system

A novel thin infrared lens comprising an infrared lens and a hard and thin substrate that allows infrared lights to penetrate, is disclosed. The infrared lens may be a Fresnel refraction lens, prepared as a thin film by injection or casting. The infrared lens is attached to the thin substrate to form a lens assembly. The infrared lens may be pressed or adhered to the thin substrate or enveloped by the thin substrate to form the assembly.

Thin infrared lens

An adapter to convert a traditional gas meter into a computerized gas meter is disclosed. The adapter of this invention comprises a microcomputer gas flow signal converting module, a gas flow monitoring module, a gas pressure monitoring module, an earthquake sensing module and a gas supply shutoff mechanism, and a casing to enclose the modules and to affixed to said traditional gas meter. The microcomputer gas flow rate signal converting module senses the movement of diaphragm of the traditional gas meter and converts the gas flow rate into computerized signals. The gas flow monitoring module and the gas pressure monitoring module monitor the gas flow rate and the gas pressure, and generate warning signals when abnormal phenomena are sensed. The earthquake sensing module senses strong earthquakes according to vertical vibration waves and horizontal vibration waves of said earthquake. The gas supply shutoff mechanism stops movements of diaphragm in order to stop gas supply when a warning signal is generated by said gas flow monitoring module, said gas pressure monitoring module or said earthquake sensing module.

Integrated gas meter

A novel earthquake sensing device is disclosed. The earthquake sensing device comprises a vertical vibrating wave sensing module, a horizontal wave sensing module and a determination module to determine the existence of an earthquake, based on, in combination, the vertical waves and the horizontal waves of an earthquake. In determining the existence of an earthquake, both the vertical waves and the horizontal waves of the earthquake are taken for consideration. Errors in the determination of earthquakes may thus be avoided.

Growing community of inventors

Hsinchu, Taiwan

Tzong-Sheng Lee