Epistar Corporation

United Epitaxy Company, Inc.

Kaistar Lighting (Xiamen) Co., Ltd.

Huga Optotech Inc.

Interlight Optotech Corporation

Industrial Technology Research Institute

United Epitaxxy Company, Ltd.

Tzer-Perng Chen

Chih-Sung Chang

Min-Hsun Hsieh

Jen-Chau Wu

Kuang-Neng Yang

Hsin-Mao Liu

Tsung-Xian Lee

Tzu-Chi Cheng

Pai-Hsiang Wang

Cheng-Nan Han

Hsing-Chao Chen

Hung-Hsuan Chen

Chih-Peng Ni

Tzong-Liang Tsai

Chuan-Cheng Tu

Ching-San Tao

Holin Chang

Chih-Chiang Lu

Chih-Ming Wang

Yuh-Ren Shieh

Masafumi Sano

Charng-Shyang Jong

Rong-Yih Hwang

Ta-Cheng Hsu

Chien-Yuan Wang

Yen-Wen Chen

Wei-Yo Chen

Chih-Li Chiang

Cheng Nan Han

Meng-Yuan Hong

Ching San Tao

Shu-Woei Chiou

Chiu-Lin Yao

Jin-Ywan Lin

Yih-Der Guo

Biing-Jye Lee

Ming-Jiunn Jou

Chin-Yuan Chen

Chung-Kuei Huang

Cheng-Chung Young

Tzong-Liang Tasi

Yung-Chuan Yang

Tien-Fu Liao

Pan-Tzu Chang

Tsun-Tsai Chang

Jyi-Ren Deng

Jenn-Yu Kao

Wei-En Chien

An LED bulb with a screw base; a cover forming an accommodation space with the screw base; an LED filament located in the accommodation space including a substrate comprising a top surface, a side surface, and an extension direction; a plurality of LED chips disposed on the first top surface; a first electrode arranged on the top surface, electrically connected to the plurality of LED chips; and a first clamp including first and second projecting prongs. The first electrode is clamped by the first and second projecting prongs within the accommodation space. The LED bulb has an imaginary rotational axis not parallel to the extension direction.

LED assembly

The disclosure discloses an optoelectronic element comprising: an optoelectronic unit comprising a first metal layer, a second metal layer, and an outermost lateral surface; an insulating layer having a first portion overlapping the optoelectronic unit and extending beyond the lateral surface, and a second portion separated from the first portion in a cross-sectional view; and a first conductive layer formed on the insulating layer.

Optoelectronic element having reflective layer in contact with transparent layer covering side and bottom surfaces of the optoelectronic element

An LED bulb with an LED assembly, including a substrate having a first top surface, longer side surface and shorter side surface; a mount disposed on the first top surface, having a first inner side surface and second inner side surface facing the first inner side surface; a plurality of LED chips on the first top surface, arranged between the first and second inner side surfaces, having a second top surface; an electrode plate formed on the mount, electrically connected to the plurality of LED chips with a third top surface which does not extend beyond the shorter side surface in a top view; and a phosphor layer covering the plurality of LED chips, mount, and electrode plate, without covering the side surfaces; and a cover covering the LED assembly. The third top surface is higher than the second top surface in an elevation based on the first top surface.

LED assembly for omnidirectional light applications

The present disclosure provides a light-emitting apparatus comprising a board having a plurality of first metal contacts and a plurality of second metal contacts on a top surface; a plurality of LEDs being bonded to the board, the each of the LEDs comprising a first cladding layer on the substrate, an active layer on the first cladding layer, a second cladding layer on the active layer, an upper surface on the second cladding layer, a first metal layer, and a second metal layer, wherein the first metal layer and the second metal layer are between the active layer and the board; an opaque layer between the adjacent LEDs and comprising a polymer mixed with a plurality of inorganic particles; and an encapsulating layer on the upper surfaces and opposite to the board, wherein the encapsulating layer does not cover a side wall of the active layer; and an underfill material between the board and the plurality of LEDs, wherein the underfill material surrounds each of the first metal layer and the second metal layer.

Plurality of light emitting devices having opaque insulating layer between them

This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip.

Optoelectronic element

An optoelectronic element includes an optoelectronic unit, a first metal layer, a second metal layer, a conductive layer and a transparent structure. The optoelectronic unit has a central line in a top view, a top surface, and a bottom surface. The second metal layer is formed on the top surface, and has an extension portion crossing over the central line and extending to the first metal layer. The conductive layer covers the first metal layer and the extension portion. The transparent structure covers the bottom surface without covering the top surface.

LED assembly for omnidirectional light appliances

The disclosure provides a multi-junction solar cell structure and the manufacturing method thereof, comprising a first photovoltaic structure and a second photovoltaic structure; wherein at least one of the first photovoltaic structure and the second photovoltaic structure comprises a discontinuous photoelectric converting structure.

Multi-junction solar cell

Disclosed are LED assemblies and their applications. An example LED assembly has an LED chip, a supportive structure and a transparent structure. The LED chip includes a transparent substrate, at least one LED cell, and two pads. The transparent substrate has a top surface with two terminals. The LED cell is formed on the top surface, and includes at least one light-emitting stack configured to emit light. The pad is formed on the top surface at the two terminals. The supportive structure has a transparent portion and a conductive portion. The conductive portion is connected to the transparent portion to fix the LED chip and supply electric power to at least one of the pads. The transparent structure encapsulates the LED cell.

This disclosure discloses an LED assembly. The LED assembly comprises a transparent substrate; a first phosphor layer; a transparent mount, having a plurality of trenches substantially in parallel to each other, wherein the first phosphor layer is positioned between the transparent substrate and the transparent mount; an LED chip, mounted on an area of the transparent mount, wherein the area is located substantially between the trenches; and a second phosphor layer inside the trenches.

An optoelectronic semiconductor device includes a substrate, a semiconductor system having an active layer formed on the substrate and an electrode structure formed on the semiconductor system, wherein the layout of the electrode structure having at least a first conductivity type contact zone or a first conductivity type bonding pad, a second conductivity type bonding pad, a first conductivity type extension electrode, and a second conductivity type extension electrode wherein the first conductivity type extension electrode and the second conductivity type extension electrode have three-dimensional crossover, and partial of the first conductivity type extension electrode and the first conductivity type contact zone or the first conductivity type bonding pad are on the opposite sides of the active layer.

Optoelectronic semiconductor device

An optoelectronic element includes an optoelectronic unit having a first top surface; a first metal layer on the first top surface; a first transparent structure surrounding the optoelectronic unit and exposing the first top surface; and a first contact layer on the first transparent structure, including a connective part electrically connected with the first metal layer.

Optoelectronic element and manufacturing method thereof

Growing community of inventors

Hsinchu, Taiwan

Tzer-Perng Chen