Industrial Technology Research Institute

Tzer-Kun Lin

Chih-Wei Chen

Hann-Tsong Wang

Yun-Chuan Tu

Chin-Ching Wu

A non-contact pick-up device is disclosed. The non-contact pick-up device mainly includes a disk, and a plurality of air nozzles on the disk. Each nozzle has an air channel; and an upper end of the channel is tilt outwards. Therefore, as a disc-shaped article is placed on the disk; air jets out from the nozzles, due to Bernoulli principle, pressure difference is formed on the disc-shaped article. Thus, due to the action of atmosphere pressure, the disc-shaped article will be clamped. The pick-up device may be used in semiconductor manufacturing process for clamping a wafer.

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Hsinchu, Taiwan

Tzer-Kun Lin