International Business Machines Corporation

Globalfoundries Inc.

Johns Hopkins University

Tze-bin Song

Devendra K Sadana

Jeehwan Kim

Keith E Fogel

Ning Li

Yang Yang

Rui Zhu

Choong-Heui Chung

A method for fabricating an optoelectronic device includes forming an adhesion layer on a substrate, forming a material layer on the adhesion layer and applying release tape to the material layer. The substrate is removed at the adhesion layer by mechanically yielding the adhesion layer. A conductive layer is applied to the material layer on a side opposite the release tape to form a transfer substrate. The transfer substrate is transferred to a target substrate to join the target substrate to the conductive layer of the transfer substrate. The release tape is removed from the material layer to form a top emission optoelectronic device.

Optoelectronics integration by transfer process

An electro-optic device includes a substructure, a layer of nanowires deposited on the substructure so as to form a network of nanowires having electrically connected junctions at overlapping nanowire portions and defining spaces void of the nanowires, and a plurality of electrically conducting and optically transparent nanoparticles disposed to at least partially fill a plurality of the spaces to provide additional electrically conducting pathways for the network of nanowires across the spaces. The network of nanowires and the plurality of electrically conducting and optically transparent nanoparticles form at least a portion of an optically transparent electrode of the electro-optic device.

Solution processed nanoparticle-nanowire composite film as a transparent conductor for opto-electronic devices

A method for fabricating a photovoltaic device includes forming an adhesion layer on a substrate, forming a material layer on the adhesion layer and applying release tape to the material layer. The substrate is removed at a weakest interface between the adhesion layer and the substrate by mechanically pulling the release tape to form a transfer substrate including the adhesion layer, the material layer and the release tape. The transfer substrate is transferred to a target substrate to contact the adhesion layer to the target substrate. The transfer substrate includes a material sensitive to formation processes of the transfer substrate such that exposure to the formation processes of the transfer substrate is avoided by the target substrate.

Transferable transparent conductive oxide

Growing community of inventors

Los Angeles, CA, United States of America

Tze-bin Song