Avago Technologies Fiber IP (Singapore) Pte. Ltd

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Avago Technologies Fiber IP Pte Ltd.

Tyler Sims

An integrated circuit is joined to a liquid container. The integrated circuit includes a passivation layer. A resistor is used as a heater to heat fluid in a liquid container. A mesa structure is formed over the passivation layer. The mesa structure is in contact with the resistor and is used to more effectively deliver heat from the resistor to the liquid container.

Use of mesa structures for supporting heaters on an integrated circuit

A switching element includes a bubble chamber, a heater and a heat conductor. The bubble chamber holds fluid. The bubble chamber includes a trench within a planar light circuit and includes a trench within an integrated circuit attached to the planar light circuit. The heater is located under the trench within the integrated circuit. The heat conductor is attached to the integrated circuit. The heat conductor is located within the trench within the integrated circuit. A portion of the heat conductor is in close proximity to the heater. The heat conductor is more heat conductive than the fluid within the bubble chamber.

Heat transfer structures

Sound signals are detected. Light signals are generated that pass through a membrane of a bubble within a trench. The sound signals cause deformations within the membrane of the bubble. The light signals are detected after the light signals have passed through the membrane. The sound signals are reconstructed from the light signals detected by the optical detector.

Fluidic acoustic transducer

Fluid within a reflection optical switch system is purified. Gettering structures are placed within a chamber within the reflection optical switch system. The gettering structures includes heating components which when actuated attract impurities. The heating components within the gettering structures are turned on to getter out impurities from fluid within the chamber.

Clean and test for fluid within a reflection optical switch system

A silicon chip is attached to a planar light circuit. A recessed moat is formed around an output perimeter of a surface of the silicon chip. When soldering the silicon chip to the planar light circuit, the recessed moat is filled with solder.

Solder seals within a switching system

A heating device within an integrated circuit includes a first conductive lead, a second conductive lead and a third conductive lead. A first resistive region is connected between the first conductive lead and the third conductive lead. A second resistive region is connected between the second conductive lead and the third conductive lead. A side formed by the first conductive lead and the first resistive region is parallel to a side formed by the second conductive lead and the second resistive region.

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Knoxville, TN, United States of America

Tyler Sims