Hzo, Inc.

Tyler Christensen Child

Vimal Kumar Kasagani

Cameron LaMar Loose

Blake LeRoy Stevens

Max Ernest Sorenson

David James Astle

Samuel R Anderson

Heidi L Popeck

Caleb Edward Kanavel

T Wade Fallin

Colin LaMar Loose

Xiaowei Shen

A mask material is readily discernible from a substrate to which the mask material is applied. The mask material may have a discernible characteristic, such as its color, luminescence or the like, which may render it visibly distinct from the substrate or detectable using automated inspection equipment. The discernible characteristic of the mask material may render it detectable through a protective coating.

Materials for masking substrates and associated methods

A method for applying a protective coating to selected portions of a substrate is disclosed. The method includes applying a mask to or forming a mask on at least one portion of the substrate that is not to be covered with the protective coating. The mask may be selectively formed by applying a flowable material to the substrate. Alternatively, the mask may be formed from a preformed film. With the mask in place, the protective coating may be applied to the substrate and the mask. A portion of the protective coating that overlies the mask may be delineated from other portions of the protective coating; for example, by cutting, weakening or removing material from the protective coating at locations at or adjacent to the perimeter of the mask. The portion of the protective coating that overlies the mask, and the mask, may then be removed from the substrate.

Masking substrates for application of protective coatings

Apparatuses and systems that enable selective removal of protective coatings from substrates are disclosed. Such a material removal system may use pressurized solid carbon dioxide (CO) (i.e., dry ice) to remove a selected portion of a protective coating from a substrate. The material removal system may include one or more templates that provide selectivity in removing protective coatings from one or more substrates, fixtures for holding one or more substrates in place while material removal processes occur and apparatuses for positioning one or more substrates at desired locations in material removal systems.

Equipment for removing protective coatings from substrates

Processes for masking electronic devices, including, but not limited to, electronic subassemblies, prior to the application of protective coatings to the electronic devices are disclosed. Such processes include the use of a plurality of different masking techniques in combination to mask the electronic device. Different masking techniques may be used to mask different features and/or components of the electronic device. Some features and/or components may be masked by way of two or more masking techniques. With one or more masks in place, an electronic device may be protectively coated. After a protective coating has been applied to the electronic device, at least a portion of the mask(s) may be removed from the electronic device. Protectively coated electronic devices may then be assembled with one another.

Use of combined masking techniques and/or combined material removal techniques to protectively coat electronic devices

A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.

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South Jordan, UT, United States of America

Tyler Christensen Child