Dell Products Inc.

Tyler B Duncan

Anthony P Middleton

Mark Mcgrath Bailey

Ty R Schmitt

Trey S Wiederhold

Michael M Toulouse

Eric Michael Tunks

Ayedin Nikazm

Joseph Andrew Vivio

Jeffery T Sayles

Mukund Purshottam Khatri

Austin Michael Shelnutt

Edmond Ira Bailey

Laurent Andrew Regimbal

Paul Theodore Artman

David Lyle Moss

Richard Mark Eiland

Colin Mahaffey

Benjamin David Behrendt

Travis Christian North

Christopher Michael Helberg

John R Stuewe

Eric C Wobig

German Florez-Larrahondo

James Samuel Davis

David S Thornton

Sharadha Parthasarathy

A system including a first section and a second section. The first section includes a first plurality of chassis associated with a first tenant and the second section comprising a second plurality of chassis associated with a second tenant. The system further includes a first pair of cooling units and a first pair of manifolds fluidly connecting the first plurality of chassis to the first pair of cooling units. The system further includes a second pair of cooling units and a second pair of manifolds fluidly connecting the first plurality of chassis to the first pair of cooling units.

System and method for per-tenant redundant thermal management using liquid cooling

An information handling system includes a chassis that includes a chassis inlet and a chassis outlet and a liquid cooling system that includes a first manifold. The first manifold includes a first chassis outlet configured to provide a first inlet coolant flow to the chassis inlet and a first chassis inlet configured to receive a first outlet coolant flow from the chassis outlet. The liquid cooling system also includes a second manifold that includes a second chassis outlet configured to provide the first inlet coolant flow to the chassis inlet, and a second chassis inlet configured to receive the first outlet coolant flow from the chassis outlet.

System and method for thermal management using liquid cooling

A modular information technology component includes: an information handling system; a floor, in which the floor includes a floor track apparatus and the information handling system is located on the floor; and a rack mounting component, in which the rack mounting component affixes the information handling system to the floor track apparatus.

Floor track and mounting apparatus for modular data centers

A modular data center includes: a modular information technology component (MITC), in which the MITC includes a plurality of information handling systems (IHSs), a utility control component (UCC), and a first connection interface, in which the first connection interface includes a first set of mechanical and electrical connection components (MECCOMs); and a modular environmental control component (MECC), in which the MECC includes a plurality of environmental control components (ECCs) and a second connection interface, in which the second connection interface includes a second set of MECCOMs to be paired with the first set of MECCOMs to generate at least a portion of the modular data center, and in which the first connection interface is connected to the second connection interface, in which an area enclosed by the first connection interface is equal to an area enclosed by the second connection interface.

Module-to-module mechanical, electrical, and airflow connections in modular data centers

A method for removing moisture from an airflow via a cooling system includes identifying a plurality of active cooling circuits in the cooling system. The method also includes lowering a first temperature set point of a first cooling circuit of the multiple cooling circuits. In addition, the method includes raising a second temperature set point of a second cooling circuit of the multiple cooling circuits.

System and method for adjusting environmental conditions

A modular information technology component (MITC) includes: an information handling system (IHS); and a hinged bracket, in which the hinged bracket comprises a hinge, a base, and a holder, in which a first portion of the base is connected to the IHS, in which a second portion of the base is connected to the hinge, in which a first portion of the holder is connected to the hinge, in which a second portion of the holder is connected to an information technology component (ITC), in which the holder and the ITC are oriented in a first direction, and in which, after rotating inward or outward about the hinge, the holder and the ITC are oriented in a second direction, in which the first direction and the second direction are different.

Adjustable hinged mounting bracket for a computing device

A method for managing environmental conditions of an information handling system includes obtaining an ambient temperature and an ambient humidity of an environment proximate to the information handling system. The method also includes determining a target relative humidity for the information handling system and determining a target temperature for the information handling system based on the target relative humidity, the ambient temperature, and the ambient humidity. Further, the method includes determining that the target temperature is within an acceptable range of temperatures. In addition, the method includes adjusting an amount of air recirculated through the information handling system, and adjusting the amount of air recirculated is based on the determination that the target temperature is within an acceptable range of temperatures.

System and method for environmental condition management

An improved method and system for heating and cooling an electronic device, when internal temperatures are below safe operating ranges. To do so, the system selectively heats or cools each zone of the electronic device. This may be done by individual heaters and/or cooling system for each separate zones. Alternatively, or in addition too, the system can selectively open and close baffles, causing fresh ambient air to enter and/or recirculate heated air in a device's enclosure. This keeps sensitive components of the computing device, such as processors and memory from suffering damage, by operating them at temperatures that are either too cold or too warm.

Independent active cooling and heating control loop per component

Multiple systems and devices for providing liquid and air cooling for IT components is disclosed. The system includes a module comprising at least one dry cooler and at least one liquid heat exchange device. The module includes a primary cooling loop with the at least one dry cooler and the at least one liquid heat exchange device. The system also includes a secondary loop that includes the at least one liquid heat exchange device and one or more IT units in a facility. The system includes a path for air cooling the one or more IT units in the facility that includes at least one air intake from outside the facility that supplies air for cooling the one or more IT units.

Scalable cooling architecture for liquid and air cooling

A modular information technology component (MITC) includes: a floor, in which the floor comprises a first floor plate (FP) and a second FP, in which the first FP and the second FP are oriented in a first plane; and a first hydraulic pump (HP) and a second HP, in which the first HP is located underneath the first FP, in which the second HP is located underneath the second FP, in which the first HP and the second HP are deactivated, in which, when an information handling system (IHS) is loaded on the second FP, the second FP becomes oriented in a second plane, in which the second plane is lower than the first plane, and in which, when the second FP becomes oriented in the second plane, the second HP is activated to raise the second FP to the first plane.

Isolated floor locking mechanism for modular data centers

A method for cooling one or more Information Technology (IT) units, the method comprising adjusting a first valve controlling liquid flow in a primary loop, wherein the primary loop comprises: at least one dry cooler of a dry cooling section, and an air/liquid exchange section comprising at least one air/liquid exchange device that provides air cooling to the one or more IT units. The method further comprising adjusting a second valve controlling liquid flow into a liquid loop interface, the liquid loop interface being connected to a secondary loop, the secondary loop comprising the one or more IT units; and at least one liquid heat exchange device of the liquid loop interface that provides liquid cooling to the one or more IT units, and wherein adjusting the first and second valves controls the ratio of liquid cooling to air cooling to the one or more IT units.

Architecture to provide liquid and closed loop air cooling

Embodiments of the present invention provide a method for powering an electronic device with a battery or other backup power supply when an external power source is removed from the electronic device. The method determines if the ambient temperature of an electronic device is below a threshold and if the ambient temperature is below the threshold adjusting a minimum state of charge of the battery to prolong the life of the battery.

Intelligent battery discharge control to support environmental extremes

A modular data center includes: a modular information technology component (MITC), in which the MITC comprises a cooling distribution unit (CDU), a floor, a bottom cooling distribution unit mounting component (CDUMC), a modular over-rack component (MORC), and a top CDUMC, in which the floor comprises a floor track apparatus (FTA), in which the bottom CDUMC affixes the CDU to the FTA, in which the top CDUMC affixes the CDU to the MORC, in which the top CDUMC provides air containment with an internal environment of the MITC; and a modular environmental control component (MECC), in which the MECC comprises a plurality of environmental control components (ECCs) and built-in airflow connection components, in which the built-in airflow connection components remove and supply air to the MITC.

Mounting apparatus for components without mounting points in modular data centers

Multiple systems for providing liquid and air cooling for IT components is disclosed. The modular system for cooling Information Technology (IT) includes a first module with at least one dry cooler that supplies liquid cooling to at least one liquid heat exchange device, and a second module with at least one liquid heat exchange device that provides liquid cooling to a facility with one or more IT units. The modular system may also provide cooling liquid to an air to liquid heat exchange device of the facility.

Standalone and scalable liquid cooling modules

A modular data center includes: a modular information technology component (MITC), in which the MITC includes a first scaffold; and a modular environmental control component (MECC), in which the MECC includes a second scaffold, in which the first scaffold is connected to the second scaffold to form a scaffold interface, in which an enclosure component is affixed to an outside surface of the first scaffold and to an outside surface of the second scaffold, and in which, once affixed to the first scaffold and to the second scaffold, the enclosure component overlaps at least a portion of the scaffold interface.

Growing community of inventors

Austin, TX, United States of America

Tyler B Duncan