Ddp Specialty Electronic Materials US, LLC

Dow Global Technolgoies LLC

Tyler Auvil

Andreas Lutz

Gary Lee Jialanella

David H Bank

Felix Koch

Daniel Schneider

Bindu Krishnan

Eric E Cole

Bharati Balijepalli

Adam K Schmitt

Cody Clinton

Thomas Clark

Gavin Vogel

Huide Zhu

Gary L Jialanflla

An epoxy-based crash durable adhesive composition including: (I) a liquid resin system comprising: (a) at least one epoxy resin; and (b) at least one toughener; wherein the viscosity of the above liquid resin system is less than about 800 Pa s at a temperature of 15&#xb0; C.; and wherein the viscosity of the above liquid resin system is greater than about 5 Pa-s at a temperature of 60&#xb0; C.; (II) a solid material comprising: (c) at least one hydrophobic fumed silica, wherein the fumed silica is present in the adhesive composition at a concentration of greater than 5 weight percent; and (III) a curative material comprising: (d) at least one latent heat-activated curing agent; wherein the rheology of the epoxy-based crash durable adhesive composition is such that the adhesive composition is pumpable at a temperature of 15&#xb0; C. or greater; and wherein the epoxy-based crash durable adhesive composition exhibits an increase in wash-off resistance; a process for making the above adhesive composition; and a process for bonding metal substrates together with the above adhesive composition.

Adhesive composition

A one-component toughened epoxy-modified polyurethane and/or urea adhesive includes a mixture of dicyandiamide and a dihdyrazide as curing agents. The mixture of curing agents permits the adhesive to be cured at lower temperatures while developing good adhesive and mechanical properties in the cured adhesive.

One-component toughened epoxy adhesives containing a mixture of latent curing agents

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Auburn Hills, MI, United States of America

Tyler Auvil