Apple Inc.

Tyler A Marshall

Dale N Memering

Christopher C Bartlow

Christopher D Jones

Victor Luzzato

Erik G De Jong

James R Wilson

Sameer Pandya

Daniel J Barrett

Differentially strengthened cover members for electronic devices are disclosed. The differentially strengthened cover members include at least one chemically strengthened zone that improves the resistance of the cover member to cracking. In some examples, one or more of the chemically strengthened zones covers or at least partially surrounds a portion of the cover member to be protected from damage.

Electronic devices having differentially strengthened cover members

A component for an electronic device including an internal compressive stress region is disclosed herein. The internal compressive stress region may be created in a glass portion of the component or in a glass ceramic portion of the component. Electronic devices comprising the components and method for making the components are also disclosed.

Electronic device having a component with crack hindering internal stress regions

Methods for evaluating a chemically strengthened housing component for an electronic device are disclosed. These methods may allow non-destructive determination of whether the chemical strengthening of the component meets specifications. Systems suitable for use with the methods are also disclosed.

Evaluation of transparent components for electronic devices

An electronic device including an optical component and an enclosure comprising a glass ceramic region is disclosed. The optical properties of the glass ceramic region and the positioning of the glass ceramic region with respect to the optical component can affect the performance of the optical component, the visual appearance of the optical component, or both.

Electronic device enclosure including a glass ceramic region

An electronic device may have a display and other optical components such as optical sensors. The display and other components may be overlapped by chemically strengthened glass coherent fiber bundles. The surfaces of a coherent fiber bundle may include ion-exchanged glass that places theses surfaces under compressive stress. In some configurations, the coherent fiber bundle is symmetrically stressed and has equal amounts of compressive stress on opposing surfaces. In other configurations, the coherent fiber bundle is asymmetrically stressed and has more compressive stress on one surface than the other. The coherent fiber bundle may have areas with curved cross-sectional profiles, planar areas, and/or areas with compound curvature. Sensor windows may be formed in the coherent fiber bundle that are surrounded by an opaque area. When overlapping a display, the coherent fiber bundle may serve as a display cover glass layer.

Electronic devices with chemically strengthened coherent fiber bundles

Electronic device components that include a glass portion and a ceramic or a glass ceramic portion are disclosed. The ceramic or glass ceramic portions of the component may be located to provide desired performance characteristics to the component, which may be an enclosure component. In addition, regions of compressive stress may be formed within the glass portion, the glass ceramic portion, or both to further adjust the performance characteristics of the component. Electronic devices including the components and methods for making the components are also provided.

Localized control of bulk material properties

Electronic device having a glass component with crack hindering internal stress regions

Components of an electronic device, such as glass articles, are susceptible to breakage, especially in regions where machining a glass article has created flaws. Chemical strengthening can be performed to create deeper compression layers at regions of a glass article that have been machined, include and/or are adjacent to an edge feature, have greater surface roughness, and/or have more or deeper cracks.

Growing community of inventors

Sunnyvale, CA, United States of America

Tyler A Marshall