E.i. Dupont De Nemours and Company

Other

Tyau-Jeen Lin

Duck Joo Yang

Joseph A Antonelli

Hirotsugu Yasuda

Patrick F McIntyre

Timothy Allan Bell

Thomas William Harding

An-Gong Yeh

Michael Patrick Chouinard

James Lewis Hohman, Jr

Laurence J Levase

Paul Francis Herman

Wronald Scott Best

Xiaoqing Li

Hamdy A Elwakil

Melville J Camelon

Jyh-Hong Eric Chen

The present invention relates to urea terminated polyurethane dispersants based on certain diols which have grafted alkyl, aryl or fluoroalkyl substituents, aqueous dispersions of such polyurethanes, the manufacture of the urea terminated polyurethane dispersions and inks containing pigments and/or disperse dyes dispersed with these urea terminated polyurethane dispersants.

Urea-terminated polyurethane dispersants

The present invention pertains to an aqueous inkjet ink made from certain aqueous titanium dioxide slurries, and an associated inkjet ink set for inkjet printing. The invention also pertains to a method of inkjet printing with the ink and ink set. The use of the specific titanium dioxide slurries described herein result in inkjet inks having improved stability and better anti-settling performance with less pigment agglomeration and flocculation over time.

Ink jet ink

A cathode assembly is described for use in the creation of a discharge plasma. The cathode comprises a plurality of electrically conductive hollow plasma generating cells in a cylindrically-shaped array, the cells being electrically connected to each other. The plasma generated can be used to modify surface properties of substrates, such as films, fibers, particles and other articles, particularly cylindrically shaped articles.

Hollow cathode array for plasma generation

This invention relates to an improved apparatus for treating the surface of particles by plasma-activated gas species to modify the particle surfaces.

Treatment of deagglomerated particles with plasma-activated species

This invention relates to the use of low temperature plasma technology for significantly improved corrosion protection of metals. The plasma process involves pretreatment of the surface of the metal with a gas plasma to remove oxygen, followed by plasma deposition of a thin polymeric film on the treated surface, followed by cathodic electrocoat application of a primer.

Method of coating metal using low temperature plasma and

A process of organic vapor deposition for significantly improved corrosion protection of metal. The process involves deposition of a thin film by polymerization of certain precursors onto the surface of a metal phosphate treated metal substrate (15). A primer or topcoat is subseqently applied over the metal substrate.

Organic vapor deposition process for corrosion protection of metal

A process for improved corrosion protection of a metal substrates involving organic vapor deposition of a thin film by polymerization of certain precursors onto one side of the phosphated flat metal substrate (15). Following stamping and assembly of the metal substrate, a primer and topcoat may be applied over the other side of the metal substrate. The process is particularly applicable to coil steel employed in the original manufacture of automobiles, trucks, and parts thereof.

Organic vapor deposition process for corrosion protection of prestamped

This invention relates to the use of low temperature plasma technology for significantly improved corrosion protection of metals. The plasma process involves pretreatment of the surface of the metal with a gas plasma comprising argon, hydrogen, or mixtures thereof, followed by plasma deposition of a thin polymeric film on the treated surface, followed by cathodic electrocoat application of a primer.

This invention relates to the use of low temperature plasma technology for significantly improved corrosion protection of steel. The plasma process involves pretreating of the steel surfaces by oxygen plasma and thin film deposition by polymerization of certain precursors on the steel. The process utilizes DC power, substrates as the cathode, magentron anodes, and system pressures of 0.01-0.5 torr. After the thin film plasma deposition it is also preferably to put a primer coating over the thin film.

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Chadds Ford, PA, United States of America

Tyau-Jeen Lin