Martin Marietta Corporation

Avx Corporation

Tushar K Shah

Andrew Paul Ritter

Keith Bridger

Paul J Caldwell

Stephen R Winzer

Natarajan Shankar

An improved transducer array includes a two-dimensional array of multilayer actuators, capable of producing very high displacement with low input voltage, integrally packaged with conditioning electronics. Preferred microcomposite actuators use multiple layers of stacked electrostrictive ceramics and conductive materials. The actuators are aligned in a two-dimensional array and can be integrated with the conditioning electronics in a variety of packaging systems. A preferred packaging system is a flexible high density interconnected multi-chip module which has the integrated circuit chips disposed in a substrate, interconnection layers disposed thereon and the multilayer composite actuators disposed on the surface of the interconnection structure. The actuators in this packaged array may be optionally addressed individually or in blocks, depending on the application intended.

Growing community of inventors

Sykesville, MD, United States of America

Tushar K Shah