Accelink Technologies Co., Ltd.

Wuhan Telecommunication Devices Company

Tuquan Chen

Chenggang Liu

Zhicheng Su

Ruyu Shi

Xuyu Song

Provided is a multi-channel light-receiving module, which comprises an incident collimator, a light-splitting assembly, an optical path conversion assembly and a photoelectric chip array which are arranged in sequence, wherein the light-splitting assembly comprises an inner reflector and a plurality of optical filters, and the optical filters are respectively arranged on an output end of the inner reflector; the channel interval of photoelectric chips in the photoelectric chip array is less than the channel interval of an adjacent optical filter; the optical path conversion assembly comprises a plurality of emergent collimators and an optical fiber connected to each of the emergent collimators; a plurality of paths of optical signals output by the light-splitting assembly are respectively coupled into corresponding optical fibers after passing through the plurality of emergent collimators; and the plurality of paths of optical signals are output by output ends of the plurality of optical fibers and are then coupled to the photoelectric chip array. By means of the light-receiving module, an optical path component is converted into a small channel interval of photoelectric chips from a large channel interval of optical filters, the problem of it being difficult to match the channel interval of optical filters and the channel interval of photoelectric chips is solved, the cost of photoelectric chips is reduced, and the assembly difficulty of optical filters is also reduced.

Multi-channel light-receiving module

The present invention applies to the technical field of photoelectric detectors and provides a high-frequency photoelectric detector encapsulation base can-packaged by using a multi-layer ceramic, comprising a laminated multi-layer ceramic substrate, wherein the multi-layer ceramic substrate is welded with pins at a bottom and provided with a metal ring at a top; an upper surface and a lower surface of each layer of the ceramic substrate are both plated with a conductive metal layer; circuit connection holes are distributed in each layer of the ceramic substrate; the upper surface of the multi-layer ceramic substrate is provided with two power contacts and two differential signal contacts; and the power contacts and the differential signal contacts penetrate through each layer of the ceramic substrate to be connected to the corresponding pins. The photoelectric detector encapsulation base is a tank-type base of a multi-layer ceramic structure, the upper and lower surfaces of each layer of the ceramic substrate are electroplated with a conductive metal layer to constitute a co-plane waveguide structure; and a differential signal transmission design being adopted in a high-speed signal line can solve the transmission problem of a signal of higher than 20 GHz in bandwidth, with a small transmission loss.

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Wuhan, China

Tuquan Chen