Ge Embedded Electronics Oy

Imbera Electronics Oy

Tuomas Waris

Antti Iihola

Petteri Palm

The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the present invention to provide an electronic module with an embedded jumper element having reliable high quality connections and contacts. To achieve at least some of the aspects of the present invention, an embedded pre-fabricated jumper module is placed inside a printed circuit board which allows the crossing of conducting lines within the module without manufacturing additional layers over the whole PCB board. The resultant PCB will have improved contacts and will not have surface deformation.

Electronic module with embedded jumper conductor

Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane and a sacrificial-material piece are attached to an insulator membrane in the location of the flexible zone. An insulator layer, which encloses within itself a sacrificial-material piece is manufactured on the surface of the conductor membrane. The flexible zone is formed in such a way that an opening is made in the insulator layer, through which the sacrificial-material piece is removed. The flexible zone comprises at least part of the flexible membrane as well as conductors, which are manufactured by patterning the insulator membrane at a suitable stage in the method.

Rigid-flex module and manufacturing method

Rigid-flex electronic module

Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane () and a sacrificial-material piece () are attached to an insulator membrane () in the location of the flexible zone (). An insulator layer (), which encloses within itself a sacrificial-material piece () is manufactured on the surface of the conductor membrane (). The flexible zone () is formed in such a way that an opening () is made in the insulator layer (), through which the sacrificial-material piece () is removed. The flexible zone comprises at least part of the flexible membrane () as well as conductors (), which are manufactured by patterning the insulator membrane () at a suitable stage in the method.

A method for manufacturing a circuit board structure comprising at least one electrical component. The method comprises the steps of fabricating a conductive pattern on the surface of an essentially plane-like layer on the back side of the plane-like layer, and forming an electrical contact between the at least one electrical component and the conductive pattern. The method further comprises the steps of attaching the at least one electrical component to the back side of the plane-like layer after the fabrication of the conductive pattern, molding encapsulation material on the back side of the plane-like layer so that the encapsulation material at least partly encloses the at least one electrical component attached to the back side of the plane-like layer, and forming holes through the conductive pattern at positions where terminals of the at least one electrical component is attached to the back side of the plane-like layer and become positioned when the at least one electrical component is attached to the circuit board structure.

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Helsinki, Finland

Tuomas Waris