Globalfoundries U.S. Inc.

Tung-Hsing Lee

Alexander Lee Martin

Anvitha Shampur

Teng-Yin Lin

Haiting Wang

Zhenyu Hu

Roderick Alan Augur

Frank Wilhelm Mont

Man Gu

Won Suk Lee

Tamilmani Ethirajan

Halting Wang

Wang Zheng

Edward J Gordon

Siva R K Dangeti

Asmaa Elkadi

The present disclosure relates to semiconductor structures and, more particularly, to dummy fill structures and methods of manufacture. The structure includes: a passive device formed in interlevel dielectric material; and a plurality of metal dummy fill structures composed of at least one main branch and two extending legs from at least one side of the main branch, the at least two extending legs being positioned and structured to suppress eddy currents of the passive device.

Dummy fill structures

Structures including a passive device and methods of forming such structures. Multiple fins are positioned on a substrate, and an interconnect structure is positioned over the substrate. The fins contain a polycrystalline semiconductor material, and the interconnect structure includes a passive device that is positioned over the fins. The passive device may be, for example, an inductor or a transmission line.

Passive devices over polycrystalline semiconductor fins

One illustrative device disclosed herein includes a semiconductor substrate and a bipolar junction transistor (BJT) device that comprises a collector region, a base region and an emitter region. In this example, the device also includes a field effect transistor and at least one base conductive contact structure that conductively and physically contacts the base region.

Lateral bipolar junction transistor device and method of making such a device

A dummy fill element for positioning inside an active inductor component of an integrated circuit (IC), the inductor component, the IC and a related method, are disclosed. The active inductor component is configured to convert electrical energy into magnetic energy to reduce parasitic capacitance in an IC. The dummy fill element includes: a first conductive incomplete loop having a first end and a second end, and a second conductive incomplete loop having a first end and a second end. First ends of the first and second conductive incomplete loops are electrically connected, and the second ends of the first and second conductive incomplete loops are electrically connected. In this manner, eddy currents created in each conductive incomplete loop by the magnetic energy cancel at least a portion of each other, allowing for a desired metal fill density and maintaining the inductor's Q-factor.

Dummy fill with eddy current self-canceling element for inductor component

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Clifton Park, NY, United States of America

Tung-Hsing Lee