General Electric Company

Transistor Devices, Inc.

Astrodyne Tdi

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Yogen Vishwas Utturkar

Mehmet Arik

Charles Erklin Seeley

Charles Franklin Wolfe, Jr

Rajdeep Sharma

Glenn Howard Kuenzler

Stanton Earl Weaver

Satish Prabhakaran

Thomas Elliot Stecher

Gary Mulcahy

Stanton Earl Weaver, Jr

Weijun Yin

Bruce Courtney Campbell Amm

Wensen Wang

Matthew Joseph Fuhrmann

Lowell Scott Smith

Douglas Glenn Wildes

Bruno Hans Haider

Charles Edward Baumgartner

Robert Stephen Lewandowski

Kathleen Melanie Amm

Reinhold Bruestle

Steinar Bjaerum

Bruce Campbell Amm

George Charles Sogoian

Juan Manuel Rivas Davila

John Santini

Chester Frank Saj

Svein Bergstoel

James Feely

Christopher Stephen Yetter

Stephen Royal Kaiser

Stanton Earl Weaver Jr

A power module and method of forming the same. The power module includes an extruded tube with internal and external fins, first and second opposing surfaces defining ends thereof, and an internal slot for housing a power converter. The power module includes a bottom plate having a first depression to receive a first O-ring to provide a first liquid-tight fluid seal at the first opposing surface for an electrically insulting oil encapsulating the power converter. The power module includes a cable interface plate having a second depression to receive a second O-ring to provide a second liquid-type fluid seal at the second opposing surface for the electrically insulting oil encapsulating the power converter. The power module includes an end cap to mate with the cable interface plate and accept a conduit fitting to enable an electrical cable to be routed from within the end cap to an external connection point.

Power module operable in a hazardous environment

A scalable liquid cooled power system using a number of modularized, hot-plug, hot-swap, and scalable liquid-cooled power conversion modules mounted on mating mounting assemblies. A modularized, scalable liquid coolant manifolds and liquid cooling management system provides coolant circulation through the power conversion modules. The system optionally includes a highly scalable system control and administration system, and optionally provides the facility for on-board liquid-to-air heat exchanger system, or off-board cooling using an external heat exchanger system.

Modular scalable liquid cooled power system

Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system.

Lighting system with thermal management system

A functional heat exchanger structure provides a hermetic seal for the power electronics. The heat exchanger includes one or more features built into the design. The features include a closed loop liquid circuit, air, or extended surfaces built-in to the design to transfer heat from the heat generating devices, spring clips snapped in built-in slots to mount heat-generating devices, preformed threaded rails to mount the printed circuit board (PCB), electrical isolation between the heat sink/cold plate and the electrical components, a sealed enclosure to provide environmental protection for the electronic components, a mounting feature to mount the sealed enclosure onto an external surface, an opening to accept a snap-in style cover, a stackable design, and an easily manifoldable configuration.

Sealed enclosure for power electronics incorporating a heat exchanger

An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected.

Method and apparatus for removing heat from electronic devices using synthetic jets

A heat sink with distributed jet cooling is provided. The heat sink includes a base for thermal connection to at least one heated object, an array of fins thermally coupled to the base, and at least one multi-orifice synthetic jet or multiple single orifice jets disposed on a side of the array of fins. A heat sink with distributed and integrated jet cooling is also provided and includes a base and an array of fins. Respective ones of at least a subset of the fins comprise a synthetic jet configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink with distributed and integrated jet cooling is provided and includes a base, an array of fins and multiple synthetic jets coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.

Heat sinks with distributed and integrated jet cooling

An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.

System and method for actively cooling an ultrasound probe

A transverse gradient coil for an MRI system is provided. The transverse gradient coil comprises a first coil layer; and an insulation layer made of thermoplastic insulation resin which has a thermal conductivity greater than 1.5 W/m&#xb7;K, the insulation layer having one side bonded to the first coil layer. A method for manufacturing the transverse gradient coil by injection molding or compression molding is also provided.

Transverse gradient coil for MRI systems and method for manufacturing the same

A thermal management system for cooling a heat generating component of a Magnetic Resonance Imaging (MRI) apparatus includes at least one heat pipe having a portion disposed proximate the heat generating component, such as a gradient coil and/or RF coil. When heat is removed from the component, a working fluid in a relatively hotter end of the heat pipe vaporizes and travels toward a relatively colder end of the heat pipe. The colder end may be operatively coupled to a heat sink for removing the heat from the colder end and increase the overall efficiency of the system. The heat pipe may be disposed along a horizontal, a vertical direction and/or along a diagonal of the heat generating component.

Thermal management system for cooling a heat generating component of a magnetic resonance imaging apparatus

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Schenectady, NY, United States of America

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