Gallant Micro. Machining Co., Ltd.

Gallant Micro. Machning Co., Ltd.

Tun-Chih Shih

Liang-Yin Huang

Ee-Sun Lim

A producing apparatus and a pre-bonding device are provided. The pre-bonding device includes a dispensing mechanism and a die-placing mechanism that is arranged adjacent to the dispensing mechanism. The dispensing mechanism is configured to form a plurality of adhesives onto a plurality of carriers, respectively. The die-placing mechanism includes a plurality of catchers configured to respectively hold a plurality of chips and a correction unit that is configured to adjust a relative position of the chips. The catchers are configured to synchronously place the chips adjusted by the correction unit onto the adhesives, respectively.

Producing apparatus

A vertically die-stacked bonder able to stack laterally dies one by one includes a self-elevating unit, a retrieval unit neighbored to the self-elevating unit, and a receiving unit neighbored to the retrieval unit. At least one die is located at the self-elevating unit. The self-elevating unit elevates one die by 90 degrees, so as to form a vertical state. The retrieval unit hands over the die in the vertical state to the receiving unit. The self-elevating unit then elevates another die by 90 degrees once again. The retrieval unit stacks laterally the another die in the vertical state to the previous die at the receiving unit. Thereupon, by stacking laterally the dies in the vertical state orderly, the speed of die stacking can be increased, the production costs can be reduced, and the productivity can be increased.

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Taipei, Taiwan

Tun-Chih Shih