Hitachi, Ltd.

Hitachi Tobu Semiconductor

Hitachi Iruma Electronic Company Ltd.

Hitachi Eastern Semiconductor

Hitachi Iruma Electronic Corp., Ltd.

Tugio Nemoto

Kunio Aiki

Satoru Ishii

Atsushi Sasayama

Haruo Kugimiya

Makoto Haneda

Tutomu Kawasaki

Norihiro Yazaki

Tsunetoshi Kawabata

In a photoelectric device, particularly, a photoelectric device for optical communication, an optical fiber is fixed at two fixing points so that the extremity of the optical fiber is disposed opposite to the light emitting surface of a laser diode chip and the optical fiber extends in a nonlinear shape, for example, in a moderate curve, between the two fixing points. Even though holding members fixedly holding the optical fiber at the two fixing points and a base member supporting the holding members are formed of a metal or metals having a coefficient of thermal expansion far greater than that of the optical fiber, and even if the distance between the two fixing points is varied due to the thermal expansion or contraction of the holding members and the base member, the optical fiber is obliged only to change the shape of extension. Therefore, the optical fiber and the solder fixing the optical fiber to the holding members at the two fixing points are not subjected to repeated stress, and hence the fatigue of the optical fiber and the solder is avoided. Accordingly, the photoelectric device is able to continue stable optical communication regardless of temperature variation.

Method of mounting a light emitting chip and an optical fiber on a

In a photoelectric device, particularly, a photoelectric device for optical communication, an optical fiber is fixed at two fixing points so that the extremity of the optical fiber is disposed opposite to the light emitting surface of a laser diode chip and the optical fiber extends in a nonlinear shape, for example, in a moderate curve, between the two fixing points. Even though holding members fixedly holding the optical fiber at the two fixing points and a base member supporting the holding members are formed of a metal or metals having a coefficient of thermal expansion far greater than that of the optical fiber, and even if the distance between the two fixing points is varied due to the thermal expansion or contraction of the holding members and the base member, the optical fiber is obliged only to change the shape of extension. Therefore, the optical fiber and the solder fixing the optical fiber to the holding members at the two fixing points are not subjected to repeated stress, and hence the fatigue of the optical fiber and the solder is avoided. Accordingly, the photoelectric device is able to continue stable optical communication regardless of temperature variation. Terminals are formed by leads having an inductance reducing thick portion that are connected to the photoelectric device inside a box-shaped housing. A thinner lead conforming to the prevailing standard connector is connected to the thick lead using ultrasonic bonding at a position outside of the housing.

Photoelectric device with leads

A light emitting device including a light emergence device, an optical fiber for receiving light emerging from the light emergence device, and an optical fiber supporting member having a groove or hole for accommodating and fixing the optical fiber. The support member is adapted to be deformed when subjected to an external force so as to enable an alignment of the optical axes of the light emergence device and the optical fiber.

Method of assembling a light emitting device with an optical fiber

Light emitting device with an optical fiber and a deformable support

Photoelectric device with optical fiber and laser emitting chip

In the photo electro device, a laser diode chip is set fixedly through a submount to a heatsink in a package. In assembling, first a ball lens is anchored to a holder of a lens support frame by clinching claws of the holder. Subsequently the surfaces of the ball lens on the obverse and reverse sides of the lens support frame are coated with nonreflective films. Then the position of the lens support frame is adjusted relatively to the laser diode chip so that the respective optical axes are aligned with each other. And after an arm is welded fixedly to the heatsink, a frame member is severed or removed to complete the work for setting the ball lens.

Photo electro device, method for manufacture of same, and lens support

A luminescent device having a luminescent element, an optical fiber for taking up the light emitted from the luminescent element, and a package accommodating the illuminant element and receiving an end portion of the optical fiber. The optical fiber is fixed at a portion near the tip thereof by a first fixing material such that its optical coupling end opposes the light emitting region of the luminescent element, while the remainder part of the portion of the optical fiber in the package is surrounded and held by a second fixing material. By virtue of the second fixing, it is possible to avoid breakage or other defects of the fiber attributable to the difference in the thermal expansion coefficient between the core portion of the optical fiber made of quartz and a jacket of the optical fiber covering the core line portion, thus attaining a higher reliability of the illuminant device. The second fixing material also prevents water from coming into the package along the optical fiber, thereby ensuring a greater moisture-proof property of the device.

Luminescent package device for coupling an optical fiber with a

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Komoro, Japan

Tugio Nemoto