Tegal Corporation

Other

Sharp Kabushiki Kaisha Corporation

Sharp Laboratories of America, Inc

Simplus Systems Corporation

Sharp Microelectronics Technology, Inc.

Asm International N.v.

International Business Machines Corporation

Advanced Technology Materials, Inc.

Intelleflex Corporation

Thien Ton Consulting Services Co., Ltd.

Waypoint Technologies

Tue H Nguyen

Tai Dung Nguyen

Lawrence J Charneski

Sheng Teng Hsu

David R Evans

Craig Alan Bercaw

Bruce Dale Ulrich

Wei-Wei Zhuang

Ananda H Kumar

Masato Kobayashi

Son Van Nguyen

David M Dobuzinsky

Srinivas H Kumar

Hongning Yang

Donald James Duncalf

Yoshihide Senzaki

Jer-shen Maa

Pai-Hung Pan

Donald M Kenney

James R Sheats

David L Harmon

Gautam Bhandari

Zhihong Zhang

Chien-Hsiung Peng

Robert A Ditizio

Karl Joseph Gifford

Srinandan R Kasi

Yanjun Ma

Robert A Barrowcliff

Arthur J Ammann

Lynn R Allen

Christopher G Rudman

Steven L Beck

Karl Joseph Dodds Gifford

Dan Carl

Boonsri Ongpipattanakul

Daniel Joseph Hutchison

Shusheng He

Greg Michael Stecker

A modular 3D printer system can include a base subsystem and multiple exchangeable components. The base subsystem can have a 3D motion module, a printhead module and a platform module. The multiple exchangeable components can include printheads having different configurations and functionalities, which can be exchangeably installed in the printhead module. The multiple exchangeable components can include platform supports having different configurations and functionalities, which can be exchangeably installed in the platform module.

Systems and methods for 3D printing with multiple exchangeable printheads

A print head comprising two shafts disposed in opposite sides of a filament to drive the filament to a heated chamber for delivering a molten material. The shafts are actively driven, for example, by two independent motors. The two shaft configuration of the print head can improve a control of the filament movement rate, especially for soft filament materials.

3D printer systems and methods

Molds including 3D printed components can be used to cast objects. A model of the object can be separated into multiple components, with each component not having non-printable overhang structures, thus allowing the components to be directly printed without support structures. Shell models and shell molds, e.g., molds with hollow interior, can be used for cost effectiveness. The surface of the printed object can be smoothened, for example, by solvent vapor (such as acetone for plastic), by sanding, or by a smooth coating. The object can be combinatorially cast.

3-D printed materials, structures and processes

Methods to form cross-linked or sintered objects include forming walls for reservoir layers, with cross-linkable or sinterable materials deposited in the reservoir layers. The cross-linkable or sinterable materials can then be cross-linked, e.g., changing the structure of the deposited cross linkable materials, or sintered, e.g., heat treated to fused the sinterable materials together. The walls for the reservoir layers can be removed after the objects are formed.

Methods to form 3D objects using cross-linkable or sinterable materials

A composite substrate includes a single crystal silicon layer on a glass or glass ceramic layer on a support layer can be used to form GaN layer without cracks. The glass or glass ceramic layer can have a set point and/or strain point below the deposition temperature of GaN, which can assist in releasing stress in the deposited GaN layer. Additionally, the composite substrate can be exposed to a heated and dry hydrogen ambient to reduce an oxide layer between the silicon layer and the glass or glass ceramic layer, to allow the formation of free standing GaN layer.

Silicon composite substrates

Large grain polysilicon films can be exfoliated on a handle substrate, such as a glass or glass-ceramic substrate. The large grain polysilicon can have high mobility for device formation, and can be used for backplane of a display or a sensor array for x-ray detection.

Structure and method for high performance large-grain-poly silicon backplane for OLED applications

A hybrid deposition process of CVD and ALD, called NanoLayer Deposition (NLD) is provided. The NLD process is a cyclic sequential deposition process, comprising introducing a first plurality of precursors to deposit a thin layer with the deposition process not self limiting, followed by introducing a second plurality of precursors for plasma treating the thin deposited layer. The plasma can be isotropic, anisotropic, or a combination of isotropic and anisotropic to optimize the effectiveness of the treatment of the thin deposited layers.

Nanolayer deposition using bias power treatment

Displays can be fabricated using driver transistors formed with high quality semiconductor channel materials, and switching transistors formed with low quality semiconductor channel materials. The driver transistors can require high forward current to drive emission of the OLED pixels, but might not require very low leakage current. The switching transistors can require low leakage current to allow the pixel capacitor to retain the signal level for accurate OLED device emission, preventing abnormal displays or cross talks.

Silicon-based backplane structures and methods for display applications

A radial cam engine with an optimized cam configuration can provide improve performance over crankshaft internal combustion engines. The cam configuration can include a flat-top or flat bottom piston motion, multiple lobe cam configurations, matching piston force with torque/force ratio in combustion phase, asymmetry piston motions for improved power transfer during combustion phase, and/or offset piston and cam configurations. The radial cam engine can be used in vehicles, such as hybrid vehicles.

Hybrid vehicles with radial engines

Composite substrates include a single crystal silicon layer disposed on a ceramic layer, including a transparent glass layer. Combination of single crystal devices and non-single crystal devices can be fabricated on a ceramic substrate.

Composite substrates of silicon and ceramic

A hybrid deposition process of CVD and ALD, called NanoLayer Deposition (NLD) is provided. The NLD process is a cyclic sequential deposition process, including introducing a first plurality of precursors to deposit a thin film and introducing a second plurality of precursors to modify the deposited thin film. The deposition using the first set of precursors is not self limiting and is a function of substrate temperature and process time. The second set of precursors modifies the already deposited film characteristics. The second set of precursors can treat the deposited film, including treatments such as modification of film composition and doping or removal of impurities from the deposited film. The second set of precursors can also deposit another layer on the deposited film. The additional layer can react with the existing layer to form a compound layer, or can have minimum reaction to form a nanolaminate film.

Nanolayer deposition process

Composite substrates include a silicon layer disposed on a ceramic layer. Different thermal expansion coefficient for the composite substrates can be achieved by changing the thermal expansion coefficient of the ceramic layer. Composite substrates can include two layers of silicon sandwiching a layer of ceramic.

A NanoLayer Deposition (NLD) process for depositing composite films of tertiary, quaternary, pentanary, and hexary stoichiometric films is provided. The inventive deposition process is a cyclic process consisting of a sequence of thin film deposition and treatment steps to obtain a desired film stoichiometry. The deposition steps are not self-limiting as in atomic layer deposition. In one embodiment for depositing a compound oxide film, the deposition process comprises a first deposition, followed by a hydrogen-containing plasma treatment, a second deposition followed by a hydrogen-containing plasma treatment, and then a third deposition followed by a hydrogen-containing plasma and then an oxygen-containing plasma treatment to produce a stoichiometric quaternary film. The cyclic process is repeated until the desired overall film thickness is achieved. The inventive process is used to fabricate high k dielectric films, ferroelectric films, piezoelectric films, and other complex oxides.

NanoLayer Deposition process for composite films

Silicon substrate having (100) crystal orientation can be wet etched to form (111) sharp tip pyramids. The sharp tip pyramids can be used to fabricate electrodes for flat panel displays, such as a plasma display panel or a field emission display.

Structure and method for single crystal silicon-based plasma light source and flat panel display panels and micro plasma sources

Growing community of inventors

South San Francisco, CA, United States of America

Tue H Nguyen