Raytheon Company

Thermavant Technologies, LLC

Tuan L Duong

Eric B Swanson

James E Benedict

Christopher R Koontz

William H Francis

Michael Hulse

Avram Bar-Cohen

Joseph A Boswell

Daniel A Pounds

Kyle L Jones

Adam D Leeds

An apparatus includes a structure configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes a lid and a body. The structure also includes (i) multiple inline and interconnected thermomechanical regions and (ii) one or more oscillating heat pipes embedded in at least some of the thermomechanical regions. Different portions of at least one of the lid and the body form the thermomechanical regions. The one or more oscillating heat pipes are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. Each of the one or more oscillating heat pipes includes at least one channel in the structure.

Thermally-enhanced and deployable structures

A system includes a pair of chassis, a housing, and a cooling module. Each chassis including multiple rails with adjacent rails defining card slots. The housing connected to the chassis in first card slots on the pair of chassis and formed to contain electronic components including a heat generating component. The cooling module connected to the chassis in second card slots on the pair of chassis and formed to contact the heat generating component through an aperture in the housing.

Aligned multi-rail high-power cooling module

An apparatus includes a structure configured to receive and transport thermal energy. The structure includes one or more materials configured to undergo a solid-solid phase transformation at a specified temperature or in a specified temperature range. The one or more materials form a heat input region configured to receive the thermal energy and a cold sink interface region configured to reject the thermal energy. The structure also includes one or more thermal energy transfer devices embedded in at least part of the one or more materials. The one or more thermal energy transfer devices are configured to transfer the thermal energy throughout the one or more materials and at least partially between the heat input region and the cold sink interface region. The one or more materials are also configured to absorb and store excess thermal energy in response to a temperature excursion associated with a thermal transient event and to release the stored thermal energy after the thermal transient event.

Integrated thermal energy transport and storage structures

An apparatus includes a first planar region having a first surface configured to contact a heat sink. The apparatus also includes at least one second planar region having a second surface configured to contact a surface of at least one heat generating component, the at least one second planar region being parallel to the first planar region and disposed in at least one plane that is offset from the first planar region. The apparatus further includes a plurality of flexure regions disposed at an angle or curved relative to the first planar region and the at least one second planar region. The plurality of flexure regions connect the at least one second planar region to the first planar region. The first planar region and the at least one second planar region are formed of at least a thermally conductive material and a stiffening material and the plurality of flexure regions are formed of at least the stiffening material.

Composite spring heat spreader

Growing community of inventors

Santa Barbara, CA, United States of America

Tuan L Duong