Seiko Epson Corporation

Tsuyoshi Yoda

Shuichi Tanaka

Ikuya Miyazawa

Kazumi Hara

Eiju Hirai

Suguru Akagawa

Hiroshi Sugita

Yasuyuki Matsumoto

Nobuaki Hashimoto

Motoki Takabe

Munehide Saimen

Toshiaki Hamaguchi

Naoya Sato

Naohiro Nakagawa

Toshinari Nanba

A MEMS device includes a wire that is formed of a conductive portion embedded into a recess opened in a first face of a substrate and a bump electrode that is electrically connected to the wire. A total width, in a second direction intersecting a first direction along which the wire extends on the first face, of an opening of the recess in a connection region where the wire and the bump electrode are electrically connected to each other is narrower than a width, in the second direction, of an opening of the recess in a region outside the connection region.

MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing method

A manufacturing method of a piezoelectric element includes forming an adhesive layer of a lead electrode on a piezoelectric element main body of a vibration plate, forming a metallic layer of the lead electrode on the adhesive layer, removing the metallic layer to leave the adhesive layer in a portion that corresponds to an extended electrode of the lead electrode using etching, patterning the remaining adhesive layer as individual extended electrodes that correspond to the piezoelectric element main body using etching, joining a protective substrate onto the vibration plate in a state in which the piezoelectric element main body is accommodated inside an accommodation hollow section and the extended electrode is positioned further on an outer side of the vibration plate than the protective substrate, layering and forming a section of the wiring on the protective substrate and the extended electrode, and patterning the wiring as individual wiring for each extended electrode using etching.

Method for manufacturing a liquid discharging head or portion thereof

A liquid ejecting head includes a first substrate in which a piezoelectric element is provided; and a second substrate on which the first substrate is connected to a first surface, in which the second substrate is provided with a penetration hole, which penetrates through the second substrate in a plate thickness direction, and penetration wiring, which is formed from a conductor that is formed in an inner portion of the penetration hole, the penetration wiring is formed from a first end portion, which is provided on a first surface side, a second end portion, which is provided on a second surface side, which is a surface that is on an opposite side to the first surface, and connection wiring, which connects the first end portion and the second end portion, and a cross-sectional area of the connection wiring in a planar direction of the first surface is smaller than cross-sectional areas of the first end portion and the second end portion in the planar direction.

Liquid ejecting head, and manufacturing method of liquid ejecting head

A conduction structure includes a device substrate (third substrate) including a conductive portion, an IC (second substrate) including an upper surface, an end surface inclined toward the upper surface, and a conductive portion (second conductive portion), a sealing plate (first substrate) including an upper surface, an end surface (first side wall portion) inclined toward the upper surface, and a conductive portion (first conductive portion), and plating layers that respectively form electrical connections between a conductive portion and a conductive portion and between a conductive portion and the conductive portion.

Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus

A conduction structure includes a device substrate (first substrate), an IC (second substrate) having an upper surface and an end surface, a sealing plate (third substrate) having an upper surface and an end surface, a conductive layer having a first part provided on an upper surface of the device substrate, a second part provided on the end surface of the IC and connected to the first part, a third part provided on the upper surface of the IC and connected to the second part, and a fourth part provided on the end surface of the sealing plate and connected to both of the first part and the second part, and a plating layer overlapped with the conductive layer.

A liquid droplet ejecting head includes a vibrating plate on which a first terminal group having first and second terminals and a second terminal group having third and fourth terminals are formed, a reservoir forming substrate which has a first wiring forming portion having first and second inclined surfaces and a second wiring forming portion having third and fourth inclined surfaces, a first wiring which is formed on the first inclined surface and is electrically connected to the first terminal, a second wiring which is formed on the second inclined surface and is electrically connected to the second terminal, a third wiring which is formed on the third inclined surface and is electrically connected to the third terminal, and a fourth wiring which is formed on the fourth inclined surface and is electrically connected to the fourth terminal.

Wiring structure, method of manufacturing wiring structure, liquid droplet ejecting head, and liquid droplet ejecting apparatus

A wiring mounting structure includes: a first base that has a first main surface, a second main surface that is an undersurface opposite to the first main surface, and an inclined surface that is formed between the first main surface and the second main surface to have an angle as a reference angle with the second main surface, which is less than 90 degrees; a second base that has a third main surface which is joined to the second main surface of the first base; an adhesive which is disposed between the second main surface of the first base and the third main surface of the second base from an end portion of the inclined surface of the first base to an exposed region on the third main surface of the second base and by which the first base and the second base are joined; and a connection wiring that is provided to be continuous on from the inclined surface through the front surface of the adhesive to the third main surface of the second base. The front surface of the adhesive is provided to be continuous to the inclined surface and thus an angle formed between the front surface of the adhesive in a portion in which the adhesive is provided to be continuous to the inclined surface and the third main surface on which the adhesive is provided is less than the reference.

Wiring mounting structure and method of manufacturing the same, and liquid ejecting head and liquid ejecting apparatus

A method of manufacturing a wiring substrate including a step of forming a through hole that includes forming a first concave portion in a substrate that extends from a second surface to a first insulating layer without passing through the first insulating layer; forming a second insulating layer at least within the first concave portion; and forming a second concave portion through the second insulating layer and the first insulating layer to expose a surface of a pad electrode, wherein the second concave portion is formed within the first concave portion; and filling the first concave portion and the second concave portion with a conductive body or forming the conductive body to coat inner walls of the first concave portion and the second concave portion, and forming the through electrode such that it is connected to the pad electrode.

Method of manufacturing a wiring substrate

A substrate includes a first insulating layer provided on a base board, a second insulating layer provided on the first insulating layer, a third insulating layer provided on the second insulating layer, a pad electrode provided on the third insulating layer, and a hole formed to penetrate the substrate and reaching the pad electrode. A diameter of the hole in the first insulating layer is larger than a diameter of the hole in the second insulating layer, and the first insulating layer and the second insulating layer are formed using different materials from each other and the second insulating layer and the third insulating layer are formed using different materials from each other.

Substrate, method of manufacturing substrate, semiconductor device, and electronic apparatus

A semiconductor device includes a semiconductor substrate and a through electrode provided in a through hole formed in the semiconductor substrate. The through electrode partially protrudes from a back surface of the semiconductor substrate, which is opposite to an active surface thereof. The through electrode includes a resin core and a conductive film covering at least a part of the resin core.

Semiconductor device, having through electrodes, a manufacturing method thereof, and an electronic apparatus

A liquid droplet ejecting head includes a vibrating plate on which terminals are formed, a reservoir forming substrate which is bonded to the vibrating plate and has a through portion having an inclined surface at an acute angle with respect to the vibrating plate as an inner wall, a substrate which is located on an opposite side to the vibrating plate through the reservoir forming substrate, is bonded to the reservoir forming substrate, and has terminals formed thereof, an IC package which is mounted on the substrate and is electrically connected to the terminals of the substrate, and wirings which are formed on the inclined surface and electrically connect the terminals on the vibrating plate and the terminals on the substrate.

A via hole is formed on a base substrate before a device circuit is formed, and thermal oxidation is performed to form a thermal oxidation layer on a surface of the base substrate on which the device circuit is formed and a surface in the via hole. The device circuit having a conductive section is formed on the base substrate after the thermal oxidation, and then, a conductive body is embedded in the via hole.

Device-mounted substrate, infrared light sensor and through electrode forming method

A liquid droplet ejecting head includes: a base substrate that has a concave portion that is formed to be open toward an upper surface and a wiring pattern; and an IC package that is electrically connected to the wiring pattern. The concave portion has a bottom portion and a pair of first side wall portions which stand obliquely on the bottom portion so as to be opposed to each other. Further, the wiring pattern has a plurality of linear objects, each of which is continuous and is constituted of a first part, a second part, and a third part. In addition, the IC package is formed in a chip shape, has a plurality of terminals which are formed on a front side surface, and is disposed such that the front side surface faces the concave portion, and each terminal is electrically connected to the first part.

Liquid droplet ejecting head, printing apparatus and method of manufacturing liquid droplet ejecting head

A method of manufacturing a device that has a semiconductor element includes: forming a first wiring on a first surface of a first member; forming a second wiring on a second surface of a second member with a gap from a connection terminal and a third wiring on an inclined plane of the second member, the second member being disposed on the first member so that the first and second surfaces face in the same direction, the third wiring being aligned with, and connecting, the first and second wirings; disposing the semiconductor element on the first or second surface; and providing plating that electrically connects the first, second and third wiring with the connection terminal, wherein the connection terminal faces the second wiring, and the plating is provided in the gap between the connection terminal and the second wiring.

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Matsumoto, Japan

Tsuyoshi Yoda