Dai Nippon Printing Co., Ltd.

Canon Kabushiki Kaisha

Tsuyoshi Yamazaki

Terutoshi Momose

Katsuya Sakayori

Yoichi Miura

Yoichi Hitomi

Michiaki Uchiyama

Nobuhiro Sakihama

Hiroshi Yagi

Shigeki Kawano

Hiroko Amasaki

Kiyohiro Takachi

Shinji Kumon

Tomoko Togashi

Tooru Serizawa

Masao Ohnuki

Hiroaki Miyazawa

Youichi Nagai

Midori Chiba

The present invention provides a measurement apparatus for measuring a shape of an object to be measured, including a processing unit configured to obtain information on the shape of the object to be measured based on an image obtained by imaging the object to be measured onto which pattern light alternately including a bright portion and a dark portion along a first direction is projected, wherein the processing unit obtains a plurality of first signals different from each other and indicating a light intensity distribution in a second direction intersecting the first direction, from a region of the image, which corresponds to the dark portion.

Measurement apparatus, calculation method, system, and method of manufacturing article

A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3&#xd7;10/% RH and 30&#xd7;10/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5&#xd7;10/% RH or less.

Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk drive

The present invention provides a substrate for suspension that includes a first structural part including a metal supporting substrate, an insulating layer, a wiring layer, and a cover layer, and a second structural part formed so as to extend continuously from the first structural part and has no metal supporting substrate. A position of an edge of an upper surface of the insulating layer coincides with a position of an edge of the lower surface of the cover layer or the position of the edge of the upper surface of the insulating layer is positioned on a side closer to the wiring layer than to the position of the edge of the lower surface of the cover layer at a boundary region between the first structural part and the second structural part.

Substrate for suspension, and production process thereof

A main object of the present invention is to provide a suspension substrate such that design freedom of a wiring layer is improved while restraining the upsizing in accordance with an increase in a wiring layer. The present invention solves the problem by providing a suspension substrate comprising a metal supporting substrate, a first insulating layer, a first wiring layer, a second insulating layer, and a second wiring layer laminated in this order, characterized in that the first wiring layer has a functional element wiring layer connected to a functional element, and the second wiring layer has a signal transmission wiring layer comprising a pair of wiring layers and connected to a recording and reproducing element.

Suspension substrate, suspension, element-mounted suspension, hard disk drive, and manufacturing method of suspension substrate

A suspension substrate according to the present invention includes an insulating layer, a metallic support layer provided on one face of the insulating layer, a wiring layer provided on the other face of the insulating layer, the wiring layer including a plurality of wirings and an alignment section located in a substrate main body region and isolated from each wiring. Further, in the substrate main body region, an alignment through hole is provided to extend through the metallic support layer, insulating layer and alignment section of the wiring layer. This alignment through hole is used for alignment for the actuator elements.

Suspension substrate, suspension, head suspension, hard disk drive, and method for manufacturing the suspension

The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.

Wet etched insulator and electronic circuit component

A magnetic head suspension having a thin metallic plate as a substrate which is caused to have a new function besides a function as a spring. The magnetic head suspension plural lines for connecting a magnetic head and a control circuit board to each other are formed over a thin metallic plate having a spring property through an insulating layer, and are integrated with the thin metallic plate A metallic pad made of a same metal layer as the plural lines is formed independently of the lines, an opening is made in a portion of the metallic pad to penetrate the insulating layer and then to reach the thin metallic plate, and an electroconductive region is formed into the opening by metal plating, thereby connecting the metallic pad and the thin metallic plate electrically to each other. Thereby, the desired portions of the suspension can be grounded through this simple structure without adopting a complicated structure wherein additional special lines for grounding are not separately laid besides the lines, which are lines for connecting a magnetic head and a control circuit board to each other.

Magnetic head suspension

The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer&#x2014;insulating layer&#x2014;second inorganic material layer or a layer construction of inorganic material layer&#x2014;insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.

A magnetic head suspension includes an insulating base (), wiring parts () formed on one surface of the insulating base () including a conductive metal layer, an elastic metal plate () provided on the other surface of the insulating base (), and a wiring protecting layer () covering the wiring parts (). The wiring protecting layer () is formed by subjecting a dry film containing an epoxy resin, an acrylic resin and a polymer containing aromatic rings to exposure and developing processes.

Growing community of inventors

Saitama, Japan

Tsuyoshi Yamazaki