Murata Manufacturing Co., Ltd.

Tsuyoshi Yamana

Takaharu Miyazaki

Nobuyuki Wada

Takanori Nakamura

Yukio Hamaji

A laminated ceramic electronic component, for example, monolithic ceramic capacitor, in which the delamination does not occur during baking and having superior thermal shock and moisture load resistance characteristics is provided. A conductive paste, used with advantage to form an internal electrode of the laminated ceramic electronic component, and a laminated ceramic electronic component using the conductive paste is provided. The conductive paste is composed of a conductive powder which is primarily Ni, an organic vehicle, a compound A containing at least one of Mg and Ca and which is an organic acid metal salt, oxide powder, metal organic complex salt and/or an alkoxide, and a compound B, having a hydrolyzable reactive group containing at least one of Ti and Zr, which adheres to the surface of the conductive powder.

Conductive paste and laminated ceramic electronic component

A ceramic green sheet having good surface roughness and few pinhole defects even when producing a thin ceramic green sheet is stably produced, to permit efficiently and securely manufacturing a multilayer ceramic electronic part in which deterioration of its life due to unevenness of interfaces between internal electrodes and ceramic layers and the occurrence of structural defects, such as delamination, bending of an electrode portion, etc, in a multilayer thin film to be suppressed. A dry sheet obtained by forming ceramic slurry to a sheet on a carrier film is smoothed by pressing using a plate press, a hydrostatic press or a calender roll under predetermined temperature and pressure conditions to improve the surface smoothness of the ceramic green sheet independently of the particle diameter of the ceramic and its dispersibility. An electrode paste is coated in a predetermine pattern on the thus-produced ceramic green sheet to form a sheet provided with an electrode. A plurality of the sheets provided with electrodes are laminated, and the burned to produce a multilayer ceramic electronic part.

Method of producing ceramic green sheet and method of manufacturing multilayer ceramic electronic part

A ceramic green sheet having good surface roughness and few pinhole defects even when producing a thin ceramic green sheet is stably produced, to permit efficiently and securely manufacturing a multilayer ceramic electronic part in which deterioration of its life due to unevenness of interfaces between internal electrodes and ceramic layers and the occurrence of structural defects, such as delamination, bending of an electrode portion, etc., in a multilayer thin film to be suppressed. A dry sheet obtained by forming ceramic slurry to a sheet on a carrier film is smoothed by pressing using a plate press, a hydrostatic press or a calender roll under predetermined temperature and pressure conditions to improve the surface smoothness of the ceramic green sheet independently of the particle diameter of the ceramic and its dispersibility. An electrode paste is coated in a predetermine pattern on the thus-produced ceramic green sheet to form a sheet provided with an electrode. A plurality of the sheets provided with electrodes are laminated, and the burned to produce a multilayer ceramic electronic part.

A laminated ceramic electronic component, such as a laminated ceramic capacitor, having superior heat shock resistance and humidity loading resistance is provided, in which no delamination occurs during a firing step. A conductive paste advantageously used for forming internal electrodes and a laminated ceramic electronic component using the conductive paste are provided. The conductive paste is a conductive powder primarily composed of Ni; an organic vehicle; a compound A which is at least one of an organic acid metal salt, an organic metal complex salt and an alkoxide, and which contains at least one of Mg, Ca and Ba; and a hydrolyzed compound B containing at least one of Al and Si; wherein the hydrolyzed compound B is adhered to the surface of the conductive powder.

Conductive paste and laminated ceramic electronic component using the same

A monolithic ceramic electronic component has a ceramic element including a plurality of ceramic layers and a plurality of internal electrode layers. Each internal electrode layer is disposed between two adjacent ceramic layers. The roughness of the interface between each internal electrode layer and each ceramic layer is about 200 nm or less, and the incidence of pores in the ceramic layer is about 1% or less by area at a polished cut cross-section. The monolithic ceramic electronic component can be a monolithic ceramic capacitor, a monolithic ceramic varistor, a monolithic ceramic piezoelectric component or a monolithic substrate.

Monolithic ceramic electronic component and method for making the same

A monolithic ceramic electronic component includes a laminate including a plurality of ceramic layers obtained by sintering a ceramic raw material powder, and a plurality of internal electrodes located between the ceramic layers and obtained by sintering a metallic powder. The ceramic layers have a thickness of about 3 &mgr;m or less and are composed of ceramic grains having an average particle diameter of more than about 0.5 &mgr;m, the particle diameter of the ceramic grains in the thickness direction of the ceramic layers is smaller than the thickness of the ceramic layers, and the internal electrodes have a thickness of about 0.2 to 0.7 &mgr;m. Preferably, the monolithic ceramic electronic component further includes an external electrode formed on each of the opposing ends of the laminate, the ceramic layers are composed of a ceramic dielectric material, and each of the plurality of internal electrodes is formed with an edge being exposed to either one of the opposing ends of the laminate so as to be electrically connected to either one of the external electrodes to form a monolithic ceramic capacitor.

Monolithic ceramic electronic component

A monolithic ceramic component has inner electrodes which are thin having a thickness of from about 0.2 &mgr;m to 0.7 min, and thereby, delamination is inhibited even though ceramic layers are thin, having a thickness up to about 3 &mgr;m. The mean particle size of the ceramic grains of the ceramic layers is up to 0.5 &mgr;m, so that the concavities and convexities at the interfaces between the inner electrodes and the ceramic layers can be reduced. Preferably, metal powder in a paste used to form the inner electrodes has a mean particle size of from about 10 to 200 nm, and thereby, the metal filling ratio and the smoothness of the inner electrodes can be enhanced, and the coverage can be improved.

The present invention provides a ceramic electronic part in which the glass components of a thick film electrode form a glass layer in the vicinity of the interface between the thick film electrode and a ceramic element to sufficiently bond the thick film electrode and the ceramic element even if small amounts of glass components are added, thereby preventing the glass added from interfering with conductivity, and sufficiently obtaining the excellent electrical characteristics of the ceramic element. The ceramic electronic part includes a ceramic element, and baked thick film electrodes provided on both main surfaces of the ceramic element and consisting of a conductive powder and glass frit, wherein each of the thick film electrodes has a conductive layer containing conductive components and a glass layer containing glass components and formed in the vicinity of the interface between the thick film electrode and the ceramic element.

Ceramic electronic part

A ceramic capacitor comprising a dielectric ceramic body having on the surface thereof a baked electrode including a fine copper powder and a glass frit including at least one member selected from boron oxide, lead oxide, and zinc oxide, the content of the glass frit being from 2 to 20 wt % based on the amount of the fine copper powder.

Ceramic capacitor

A ceramic capacitor with a dielectric ceramic body having on the surface thereof a baked electrode containing a fine copper powder and a glass frit containing at least one member selected from boron oxide, lead oxide, and zinc oxide, the content of the glass frit being from 2 to 20 wt % based on the amount of the fine copper powder.

An electrically conductive paste effectively protects copper powder from oxidation and provides good solderability and terminal strength. It is composed of a copper powder, a glass frit in an amount of 2-20 wt % of the copper powder, an organic vehicle in an amount of 10-30 wt % of the solid component (the copper powder and glass frit), and a solution of a borate ester having a high boiling point, a solution of boric acid, a solution of an organic salt of boron, and a solution of a borate ester having a low boiling point in an alcohol having a high boiling point, the amount of the solution being 0.01 to 0.5 wt % in terms of boron and based on the copper powder.

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Kyoto, Japan

Tsuyoshi Yamana