Other

Hitachi Via Mechanics Ltd.

Tsuyoshi Yamaguchi

Yoshitatsu Naito

Yoshitada Oshida

Mituhiro Suzuki

Mitsuhiro Suzuki

Kosuke Inoue

Takamichi Suzuki

Michiharu Honda

Hitoshi Odashima

Shigenobu Maruyama

Tatsuya Yoneda

Tetsuo Murakami

Katsuhiro Iwashita

Katuhisa Tanaka

Asahi Tsuchiya

Kouji Sajiki

Bunji Uchiyama

Izumi Hata

A parallel glass which is a prism having a parallelogram-shaped cross section in an x-y direction, and parallel glasses which are prisms having a parallelogram-shaped cross section in the x-y direction and each include grooves formed in one surface in a z direction perpendicular to the x-y direction, are stacked in direct contact with each other such that the grooves are located on the inside, and light trying to enter the grooves is subjected is total reflection, thereby changing incident parallel beams with a pitch of 13 mm into emergent parallel beams with a pitch of 1 mm.

Device for changing pitch between light beam axes, and substrate exposure apparatus

A pattern exposure method and a pattern exposure apparatus in which the throughput is improved with an inexpensive apparatus and without a low running cost. Output faces of a plurality of laser beams emitted from a plurality of semiconductor lasers respectively are arranged in two directions. One of the directions is the same direction as the scanning direction of a polygon mirror while the other is a direction crossing the scanning direction of the polygon mirror. In this event, the array pitch of the output faces arranged in the direction crossing the scanning direction of the polygon mirror is made equal to resolution of an exposure pattern. In this event, the wavelength of each laser may be made not longer than 410 nm.

Pattern exposure method and pattern exposure apparatus

A turntable assembly not requiring use of plastic centering hooks, enabling simplification of the mold structure, and enabling attachment of the leaf springs imparting elastic spring force in the disk centering mechanism even after fitting the center hole of the turntable over the motor shaft, wherein the turntable assembly has a motor having a projecting motor shaft and a turntable having a center hole into which the projecting portion of the motor shaft is inserted and a magnet holding groove formed at a disk hole mating hub around the center hole and holding a permanent magnet for clamping an information storage disk placed on the turntable in the magnet holding groove, the disk centering mechanism having a plurality of spring seats at spring flexing spaces formed at intervals in the circumferential direction of the disk hole mating hub each of the spring seats being provided with a centering leaf spring having a vertically descending piece protruding slightly outward in the radial direction from the outer circumference of the disk hole mating hub.

Turntable assembly having disc centering lead springs clamped between upper surface of turntable and an insert-type spring holder

There are disclosed a solder bump forming method and an apparatus therefor, which achieve a high reliability, and an electronic part, produced by this method and this apparatus, is also disclosed. For each of the step of arraying solder balls, the step of supplying a flux, and the step of mounting the solder balls on a board, it is checked whether or not any solder ball is omitted, and the process is conducted while confirming the condition of the operation, thereby enhancing the reliability and also preventing defective products from being produced.

Bump forming method and apparatus therefor

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Ebina, Japan

Tsuyoshi Yamaguchi