Dai Nippon Printing Co., Ltd.

Tsuyoshi Tsunoda

Yuichi Yamamoto

Masaya Tanaka

Ryohei Kasai

Shuji Sagara

Chikao Ikenaga

Kouji Tomita

Disclosed is a wiring substrate including: a first wiring layer, a second wiring layer disposed on the first wiring layer interposed by an insulating film, and a via conductor passing through the insulating film in a thickness direction, the via conductor electrically connecting the first wiring layer and the second wiring layer. The second wiring layer and the via conductor include a second sintered metal layer and a first sintered metal layer arranged to surround the second sintered metal layer, and an average particle diameter of first metal particles forming the first sintered metal layer is smaller than an average particle diameter of second metal particles forming the second sintered metal layer.

Mounting component and electronic device

Mounting component, wiring substrate, electronic device and manufacturing method thereof

A semiconductor package is comprised of a semiconductor device mounted on a die-pad , a wire for electrically connecting some electrodes of the semiconductor device and terminals of lead frame, wires for bonding the other electrodes of semiconductor device to the surface of die-pad for grounding, and molding compound for encapsulating the outer area of semiconductor device under a state where the back face of die-pad . The lower face and side face of terminals are exposed, wherein portions plated with silver for connecting of wires on the surface of the die-pad are formed at points positioned between a peripheral edge of the die-pad and an outer edge of the semiconductor device while leaving spaces from both the edges. The adhesion of die-pad to bonding compound is improved to avoid the occurrence of wires coming-off even if heat is applied to the contact points of die-pad to wires when mounting semiconductor package on a printed circuit board.

Semiconductor package

Growing community of inventors

Tokyo, Japan

Tsuyoshi Tsunoda