Tsuyoshi Tazawa

Yoshinobu Ozaki

Kei Itagaki

Naohiro Kimura

Keisuke Ohkubo

Ayako Taira

A collet for compressing an adhesive-attached chip, the collet including a main body having a first pressing surface to which a pressing force from a compressing device is directly transmitted, and a projecting portion projecting from the main body and having a second pressing surface provided along an outer circumference of the first pressing surface, the first pressing surface and the second pressing surface forming a holding surface for holding the adhesive-attached chip.

Method of manufacturing semiconductor device and collet

A method for evaluating pickup property of a dicing/die-bonding integrated film including a base layer, an adhesive, and a bonding adhesive layer in order, the method including preparing a laminate including the dicing/die-bonding integrated film and a wafer having a thickness of 10 to 100 μm laminated on the bonding adhesive layer, singulating the wafer into a plurality of chips having an area of 9 mmor less, pushing a center portion of the chip from a side of the base layer, and measuring a peeling strength when an edge of the chip is peeled off from the adhesive layer.

Method for evaluating pickup performance, integrated dicing/die-bonding film, method for evaluating and selecting integrated dicing/die-bonding film, and method for manufacturing semiconductor device

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Tokyo, Japan

Tsuyoshi Tazawa