Fujitsu Corporation

Tsuyoshi So

Hideo Kubo

Keita Hirai

Naofumi Kosugi

Yoshinori Uzuka

Nobumitsu Aoki

Osamu Aizawa

Seiji Ueno

Osamu Igawa

Takaya Nakayama

Yuki Kanai

Koji Nakagawa

Jiro Tsujimura

Nobuyuki Hayashi

Teru Nakanishi

Takeshi Nishiyama

Hideki Maeda

Masayuki Watanabe

Junichi Ishimine

Yoichi Sato

Hitoshi Nori

Shinnosuke Fujiwara

An electronic card includes a substrate, an electronic device bonded to the substrate via a solder bump, and configured to include a first ceiling, and a cover fixed to the substrate, provided over the electronic device, and configured to include a second ceiling that faces the first ceiling, wherein the first ceiling or the second ceiling is provided with an annular member extending in a facing direction of the first ceiling and the second ceiling, the annular member forming an annular shape along a circumferential direction of the first ceiling, wherein the first ceiling and the second ceiling form a gap between the first ceiling and the second ceiling filled with a filling material inside the annular member, and wherein the second ceiling includes a through hole at a position that overlaps the filling material when viewed in a plan view of the second ceiling.

Electronic card, method of manufacturing electronic card, and electronic apparatus

A liquid immersion cooling device for information processing apparatuses. The liquid immersion cooling device includes an immersion tank, a refrigerant liquid that is retained in the immersion tank, and a plurality of fillers that are filled in the immersion tank and that float on a surface of the refrigerant liquid to cover the surface of the refrigerant liquid.

Liquid immersion cooling device and information processing apparatus

An information processing device includes a board, a receiver that includes a top wall facing the board, the receiver to allow a coupling device to be inserted into a space between the board and the top wall, a movable part provided in the top wall, the movable part to be movable in a direction facing the board, the movable part having a contact portion to be in contact with a top surface of the coupling device, an elastic part that has elasticity provided at the movable part, the elastic part urging the movable part toward the board, a heat sink thermally coupled to the movable part through the elastic part, a housing positioned over a side opposite the board relative to the heat sink, the housing having a facing wall facing the heat sink, and a fan to supply wind to the heat sink along the facing wall.

Information processing device and board device

A manifold includes: a branch pipe including an inflow port and a plurality of outflow ports; and a partition wall that partitions an inside of the branch pipe into a side of the inflow port and a side of the plurality of outflow ports and includes: a plurality of through-holes that have a total opening area greater than an opening area of the inflow port; and a plurality of first facing portions that face the respective outflow ports.

Manifold and information processing apparatus

An information processing apparatus includes a plurality of electronic apparatus stacked over a plurality of hierarchies in the information processing apparatus, a heat exchanger that cools refrigerant liquid for cooling the plurality of electronic apparatus, a first distributor that distributes the refrigerant liquid from the heat exchanger to the plurality of hierarchies, a plurality of second distributor that stores the refrigerant liquid temporarily, and a plurality of pipes that branched from the distribution pipes to the plurality of the electronic apparatus, wherein the number of the second distributor increases toward a hierarchy on downstream side, the pipes of the last hierarchy are coupled to the electronic apparatus.

Information processing apparatus

A substrate includes a circuit board, a heat generator mounted over a mounting surface of the circuit board, a heat sink in contact with the heat generator, a retainer attached to the mounting surface so as to retain the heat generator and reinforce the circuit board, and a fastener configured to fix the heat sink to the retainer so as to bring the heat sink into contact with the heat generator.

Substrate

A rack mount-type information processing apparatus includes: a plurality of slots, into each of which an electronic device is inserted, a liquid-cooled element provided in a cooling target included in the electronic device, a liquid to cool the cooling target being circulated in the liquid-cooled element; a manifold pipe extending in a direction where the slots are arranged; and a plurality of connection pipes configured to interconnect the liquid-cooled element and the manifold pipe, and coupled in parallel to the manifold pipe at a portion of the manifold pipe which corresponds to at least one slot among the plurality of slots.

Rack mount-type information processing apparatus and rack mount-type information processing system

A cooling system includes an immersion tank that includes a liquid coolant sealed therein, a housing that includes through-holes formed in a top portion and a bottom portion thereof, respectively, and disposed within the immersion tank, an electronic device disposed in the housing in a state of being immersed in the coolant, a coolant flow path formed between an inner surface of the immersion tank and an outer surface of the housing to couplet he through-hole in the top portion of the housing to the through-hole in the bottom portion of the housing so that the coolant flows therethrough, and a heat transfer member that transports heat of the coolant in the coolant flow path to an outside of the immersion tank.

Cooling system and method of cooling electronic device

A liquid immersion bath includes: a liquid immersion bath main body in which liquid coolant and an electronic device to be immersed in the coolant are placed; a coolant inlet and a coolant outlet provided to the liquid immersion bath main body; a coolant discharge port which floats on a liquid surface of the liquid coolant in the liquid immersion bath main body; and a hose which couples the coolant outlet and the coolant discharge port and bends in accordance with a movement of the coolant discharge port due to variation in a height of the liquid surface.

Liquid immersion bath and liquid immersion cooling apparatus

A cooling device includes: a refrigerant circulation loop configured to depressurizing the inside thereof, the refrigerant circulation loop includes, an evaporator that vaporizes a part of refrigerant by heat generated by an electronic component, a condenser that cools the refrigerant, and a pump that circulates the refrigerant, wherein a filling ratio of liquid refrigerant to a volume of the refrigerant circulation loop is configured to maintain a refrigerant circulation capability of the pump.

Cooling device and electronic equipment

A liquid loop cooling apparatus includes: an evaporator thermally coupled to a heating element; a condenser configured to be cooled by an airflow; a pump configured to circulate a refrigerant between the evaporator and the condenser; a first piping configured to couple the evaporator and the condenser; a second piping configured to couple the condenser and the pump; and a third piping configured to couple the pump and the evaporator, wherein the first piping is arranged on a destination side of the airflow, and the second piping is arranged on a source side of the airflow.

Liquid loop cooling apparatus, electronic instrument, and method for manufacturing liquid loop cooling apparatus

An information processing device includes: one or more information processing device main bodies; a first heat exchanger configured to cool air to be introduced into the one or more information processing device main bodies; an air blower configured to introduce the air into the one or more information processing device main bodies; an evaporator through which discharged air discharged from the one or more information processing device main bodies passes; a receiving pan configured to receive water generated by dew condensation in the first heat exchanger; and a water supply member configured to supply the water in the receiving pan to the evaporator.

Information processing device and container for data center

There is provided an evaporator including: a container including a top plate, and a bottom plate configured to be heated by an electronic component; a reinforcing member having a tubular shape extending from the bottom plate to the top plate, and configured such that a coolant is introduced inside the reinforcing member; a side opening formed in a side portion of the reinforcing member, and configured to allow the coolant to flow out to the bottom plate; and a discharge port provided in the top plate outside the reinforcing member, and configured to discharge vapor from the container, the vapor being generated by the coolant contacting the bottom plate.

Evaporator, cooling device, and electronic apparatus

A disclosed method of joining a cooling component includes joining an electronic component and a spherical shaped bottom plate of a cooling component to each other by pressing the bottom plate against the electronic component, while providing a thermal bonding material between the bottom plate and the electronic component.

Method of joining cooling component

A bonding material is placed on an electronic component. a heat conductive member is superposed on the surface of the bonding material so that a thermosetting adhesive is interposed between the heat conductive member and a substrate. The thermosetting adhesive is then cured at a temperature lower than the melting point of the bonding material. The bonding material melts after the thermosetting adhesive has cured. While a distance is maintained between the heat conductive member and the substrate, the thermosetting adhesive is cured. The heat conductive member is thus reliably prevented from a downward movement regardless of the melting of the bonding material. A space is maintained between the heat conductive member and the electronic component. The cured bonding material is reliably prevented from suffering from a reduction in the thickness.

Growing community of inventors

Kawasaki, Japan

Tsuyoshi So