Murata Manufacturing Co., Ltd.

Tsuyoshi Saito

Hiroaki Kaida

Satoshi Ishino

Jiro Inoue

Michinobu Maesaka

Mamoru Ogawa

Kenji Kubota

A method of forming an electronic component includes laminating ceramic green sheets on a support film to obtain a ceramic green sheet laminate, forming through holes through the ceramic green sheet laminate at positions where via hole electrodes are to be located, applying conductive material into the through holes so as to fill the through holes and so as to be located on the upper surface of the ceramic green sheet laminate to form via hole electrodes, and sintering the ceramic green sheet laminate to form a substrate and so as to form protruding portions of the via hole electrodes which protrude upward from the upper surface of the substrate.

Method of forming an electronic component located on a surface of a package member with a space therebetween

An electronic component includes a package member; a via hole electrode extending through the package member and protruding from a first surface of the package member; an electronic component located on the first surface of the package member with a space located between the package member and the electronic component. The space between the electronic component and the first surface of the package member is provided by a protruding portion of the via hole electrode which extends from the surface of the package member and a joining member joining the electronic component with the via hole electrode.

Apparatus having an electronic component located on a surface of a package member with a space therebetween

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Fukui, Japan

Tsuyoshi Saito