Other

Ebara Corporation

Tsuyoshi Sahoda

Hiroshi Nagasawa

Akira Fukunaga

Takashi Miyake

Seiji Iimura

Yukio Fukunaga

Xinming Wang

Akira Owatari

Yukiko Nishioka

Daisuke Takagi

Akihiko Tashiro

Ryoichi Kimizuka

Yoshitaka Terashima

Hideki Hagiwara

Megumi Maruyama

A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes: cleaning a surface of a substrate having a base metal formed in the surface with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; bringing the surface of the substrate after the cleaning into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate; and forming a metal film by electroless plating on the catalyst-applied surface of the substrate.

Method for processing substrate

A copper plating bath comprising a reaction condensate of an amine compound and glycidyl ether and/or a quaternary ammonium derivative of this reaction condensate, and a plating method using this copper plating bath are disclosed. A copper plating bath capable of providing highly reliable copper plating on a substrate such as a silicone wafer semiconductor substrate or printed board having minute circuit patterns and small holes such as blind via-holes, through-holes, and the like, and a method of copper plating using the copper plating bath can be provided.

Copper plating bath and plating method for substrate using the copper plating bath

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Tokyo, Japan

Tsuyoshi Sahoda