Ckd Corporation

Tsuyoshi Ohyama

Norihiko Sakaida

Takahiro Mamiya

Nobuyuki Umemura

Kazuyoshi Kikuchi

Manabu Okuda

Hiroyuki Ishigaki

Yukihiro Taguchi

Ikuo Futamura

Akira Kato

Takamasa Ohtani

Shunji Maruyama

Takayuki Shinyama

Naohiro Zaima

A screen mask inspection device inspects a screen mask including a screen opening that forms a printing pattern, and includes: an inspection control device that detects solder position information of a solder paste printed on a substrate via the screen opening, and based on the solder position information, determines whether a quality of printing using the screen mask is good or bad, the solder position information being based on an amount of positional misalignment of the solder paste actually printed on the substrate relative to a predetermined reference position.

Screen mask inspection device, solder printing inspection device, and method for inspecting screen mask

A solder printing inspection device includes: an illumination device that irradiates, with a predetermined light, a printed circuit board on which a solder paste is printed; an imaging device that takes an image of the printed circuit board irradiated with the predetermined light and obtains image data; and a control device that: based on the image data, obtain three-dimensional measurement data of the solder paste printed on the printed circuit board, based on the three-dimensional measurement data, extracts upper portion shape data of an upper portion of the solder paste, the upper portion having a height equal to or higher than a predetermined height, and compares the upper portion shape data with a predetermined criterion and determines whether a quality of a three-dimensional shape of the upper portion of the solder paste is good or poor.

Solder printing inspection device

A substrate foreign matter inspection device includes: an image data obtaining device that obtains image data of a target inspection area in the printed circuit board including a printed portion of the solder paste; a storage that stores a neural network and a model, the model being generated by learning of the neural network that includes an encoding portion and a decoding portion by using, as learning data, only image data of the target inspection area that do not include any foreign matter; and a control device that obtains reconfigured image data by inputting original image data obtained by the image data obtaining device into the model, compares the original image data with the reconfigured image data, and determines whether any foreign matter is present or absent on the printed circuit board based on a result of comparison with the reconfigured image data.

Substrate foreign matter inspection device and substrate foreign matter inspection method

An inspection device includes: X-ray irradiators that irradiates, with a predetermined X-ray from a first film-side, inspection ranges that respectively correspond to positions of packaging sheets to be separated from the packaging film; an imaging device that is disposed on a second film-side and opposed to the X-ray irradiators across the packaging film, that comprises an X-ray detector comprising detection elements arrayed along the film width direction and detecting the X-ray transmitted through the packaging film, and that successively outputs X-ray transmission image data obtained every time the packaging film is conveyed by a predetermined amount; and a controller that inspects the packaging sheet based on the X-ray transmission image data obtained by the imaging device.

Inspection device, packaging sheet manufacturing device, and packaging sheet manufacturing method

An inspection device includes: an electromagnetic wave irradiator that irradiates, with a predetermined electromagnetic wave from a first film side, the package that is conveyed along a predetermined direction and that has the spaces at a plurality of positions in a width direction; an imaging device that is disposed opposed to the electromagnetic wave irradiator across the package, includes an electromagnetic wave detector including a plurality of detection elements that is arrayed along the width direction and that detects the electromagnetic wave radiated from the electromagnetic wave irradiator and transmitted through the package, and sequentially outputs an obtained electromagnetic wave transmission image every time the package is conveyed by a predetermined amount; and an image processing device that processes an image signal output from the imaging device.

Inspection device, packaging machine, and package inspection method

A three-dimensional measurement apparatus measures measurement targets placed in a target measurement area on a measurement object. The apparatus includes: a measurement module that: is positioned with respect to the target measurement area, and includes: a first irradiator that irradiates the target measurement area with predetermined light for height measurement; a second irradiator that irradiates the target measurement area with predetermined patterned light for three-dimensional measurement; and an imaging device that takes an image of the target measurement area; and a control device that moves the measurement module in a height direction and successively positions the measurement module at a predetermined height position determined by mapping, and performs, based on image data taken by irradiating the target measurement area with predetermined patterned light, three-dimensional measurement to the measurement targets at the predetermined height position.

Three-dimensional measurement apparatus and three-dimensional measurement method

A three-dimensional measurement device performs three-dimensional measurement of a measured object using a phase shift method. The three-dimensional measurement device includes: an irradiator that irradiates the measured object with a predetermined light pattern having a light intensity distribution in a fringe shape; a control device that shifts a phase of the light pattern radiated from the irradiator in N different ways, where N is a natural number of not less than 3; and an imaging device that takes an image of the measured object irradiated with the light pattern. The control device executes three-dimensional measurement of the measured object by the phase shift method based on N different image data taken under the light pattern having the phase shifted in the N different ways.

Three-dimensional measurement device and three-dimensional measurement method

A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device including: an irradiator that irradiates the solder and the adhesive with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive; and a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group.

Substrate inspection device that inspects application quality of adhesive

An inspection device is used in manufacture of a PTP sheet that comprises a container film including a pocket portion in which a content is placed and a cover film closing the pocket portion. The inspection device includes: an illumination device that emits near infrared light; a light shield that is placed between the illumination device and the container film and prevents the near infrared light from entering the container film; a through hole in the light shield that allows the near infrared light to pass through; a spectroscope that disperses reflected light from the content; an imaging device that images an optical spectrum of the reflected light and obtains spectroscopic image data; and a controller that: obtains spectral data of the content based on the spectroscopic image data; and performs a predetermined inspection with regard to the content based on the spectral data of the content.

Inspection device and PTP packaging machine

An inspection device includes: an irradiator that irradiates an object with near-infrared light; a spectroscope that has a slit where reflected light enters and that disperses the reflected light into wavelength component lights; an imaging device that comprises an imaging element that takes a spectroscopic image of the wavelength component lights; and a processor that: obtains spectral data based on the spectroscopic image; and detects a type of the object using a predetermined analysis based on the spectral data. Each of the wavelength component lights is a single wavelength light, the inspection device satisfies L&#x2265;2P, where L is a width of each of the wavelength component lights in a wavelength dispersion direction on a light receiving surface of the imaging element and P is a width of a pixel in the wavelength dispersion direction on the light receiving surface.

Inspection device, PTP packaging machine and PTP sheet manufacturing method

An inspection device includes: an irradiator that irradiates an object with near-infrared light; a spectroscope that disperses reflected light from the irradiated object; an imaging device that takes a spectroscopic image of the reflected light; a processor that: obtains spectral data of a plurality of points on the object, based on the spectroscopic image; defines a group of similar spectral data from among the spectral data of the plurality of points; extracts a group having a largest number of spectral data from the defined group; calculates an average of the spectral data of the extracted group; and detects a type of the object using a predetermined analysis of the object, based on the average.

A solder printing inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder on the substrate on which a thermosetting adhesive is applied, the solder printing inspection device including: an irradiator that irradiates the solder with light; an imaging device that takes an image of the irradiated solder; a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group; outputs mounting position adjustment information to the component mounting machine.

Solder printing inspection device, solder printing inspection method and method of manufacturing substrate

A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder.

Component mounting system and adhesive inspection device

A PTP packaging machine includes: a filler that fills a predetermined content into pocket portions formed in a strip-shaped container film; a sealer that is provided on a downstream side of the filler and mounts a strip-shaped cover film to the container film to close the pocket portions and obtain a strip-shaped PTP film including the cover film mounted to the container film; and a puncher that is provided on a downstream side of the sealer and punches out an expected sheet portion of the PTP film that is a region of eventually forming a predetermined PTP sheet and thereby obtain the PTP sheet.

PTP packaging machine

A three-dimensional measurement device includes: a projector that includes: a light source that emits predetermined light; and a reflective optical modulator that converts the predetermined light into a predetermined striped pattern, wherein the projector projects the predetermined striped pattern onto a measurement object at a predetermined number of frames per unit time; an imaging device that takes an image of the measurement object projected with the predetermined striped pattern; a processor that: controls the projector and the imaging device to sequentially project a plurality of different ones of the predetermined striped pattern and take images of the plurality of different ones of the predetermined striped pattern to obtain a plurality of image data having different light intensity distributions; and executes three-dimensional measurement of the measurement object based on the plurality of image data.

Growing community of inventors

Aichi, Japan

Tsuyoshi Ohyama