Sony Corporation

Tokyo Electron Limited

Tsuyoshi Ohno

Hitoshi Nakanishi

Toshihiko Kikuchi

Toshiaki Edamitsu

Machi Moriya

Yoshitaka Saita

The present invention is a processing method including a processing step of performing predetermined processing for a workpiece; an unnecessary portion removal step of removing an unnecessary portion produced on a surface of the workpiece due to the predetermined processing; and a surface structure evaluation step of evaluating a surface structure of the workpiece from which the unnecessary portion has been removed by the unnecessary portion removal step.

Processing method and processing system

An image pickup apparatus includes an image-pickup optical system, three color separation prisms separating incident light guided by the image-pickup optical system into three-primary-color light components and emitting the light components, and three image pickup elements respectively receiving the three light components from the prisms so as to produce respective image signals. Of the three prisms, a first prism that first receives the incident light has an edge extending parallel to an incidence plane. The image-pickup optical system has a plate-like fixed aperture stop disposed between the first prism and a final lens, disposed closest to the first prism, of multiple lenses included in the image-pickup optical system. The fixed aperture stop has an aperture that limits the incident light. An edge section of the aperture has projections and depressions arranged at least in parallel to the edge, as viewed from an optical-axis direction of the final lens.

Image pickup apparatus with a fixed aperture stop having an aperture with different, repetitive first and second wave patterns

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Tokyo, Japan

Tsuyoshi Ohno